HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 187

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
6.5
The CPU is driven by a system clock (φ), denoted by the symbol φ. The period from one rising
edge of φ to the next is referred to as a "state." The memory cycle or bus cycle consists of one,
two, or three states. Different methods are used to access on-chip memory, on-chip peripheral
modules, and the external address space.
6.5.1
On-chip memory is accessed in one state. The data bus is 16 bits wide, permitting both byte and
word transfer instruction. Figure 6.4 shows the on-chip memory access cycle. Figure 6.5 shows the
pin states.
Basic Timing
On-Chip Memory (ROM, RAM) Access Timing
Internal address bus
Read
access
Write
access
φ
Figure 6.4 On-Chip Memory Access Cycle
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Bus cycle
Address
T
Rev.7.00 Dec. 24, 2008 Page 131 of 698
1
Read data
Write data
REJ09B0074-0700

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