PIC18F4431-E/PT Microchip Technology, PIC18F4431-E/PT Datasheet - Page 7

• Manufacturer Part Number: PIC18F4431-E/PT
• Description: IC MCU FLASH 8KX16 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F4431-E/PT

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC18
• No. Of I/o's: 36
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 768Byte
• Cpu Speed: 40MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 I/O Ports ................................................................................................................................................................................... 107
11.0 Timer0 Module ......................................................................................................................................................................... 133
12.0 Timer1 Module ......................................................................................................................................................................... 137
13.0 Timer2 Module ......................................................................................................................................................................... 143
14.0 Timer5 Module ......................................................................................................................................................................... 145
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 151
16.0 Motion Feedback Module ......................................................................................................................................................... 159
17.0 Power Control PWM Module .................................................................................................................................................... 181
18.0 Synchronous Serial Port (SSP) Module ................................................................................................................................... 211
19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 221
20.0 10-bit High-Speed Analog-to-Digital Converter (A/D) Module.................................................................................................. 243
21.0 Low-Voltage Detect .................................................................................................................................................................. 261
22.0 Special Features of the CPU.................................................................................................................................................... 267
23.0 Instruction Set Summary .......................................................................................................................................................... 287
24.0 Development Support............................................................................................................................................................... 331
25.0 Electrical Characteristics .......................................................................................................................................................... 337
26.0 Preliminary DC and AC Characteristics Graphs and Tables.................................................................................................... 371
27.0 Packaging Information.............................................................................................................................................................. 373
Appendix A: Revision History............................................................................................................................................................. 379
Appendix B: Device Differences ........................................................................................................................................................ 379
Appendix C: Conversion Considerations ........................................................................................................................................... 380
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 380
Appendix E: Migration from Mid-range to Enhanced Devices ........................................................................................................... 381
Appendix F: Migration from High-end to Enhanced Devices ............................................................................................................. 381
INDEX ................................................................................................................................................................................................ 383
On-Line Support................................................................................................................................................................................. 391
Systems Information and Upgrade Hot Line ...................................................................................................................................... 391
Reader Response .............................................................................................................................................................................. 392
PIC18F2331/2431/4331/4431 Product Identification System ............................................................................................................ 393
 2003 Microchip Technology Inc.
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 21
Power-Managed Modes ............................................................................................................................................................. 31
Reset .......................................................................................................................................................................................... 45
Memory Organization ................................................................................................................................................................. 57
Flash Program Memory.............................................................................................................................................................. 75
Data EEPROM Memory ............................................................................................................................................................. 85
8 X 8 Hardware Multiplier ........................................................................................................................................................... 89
Interrupts .................................................................................................................................................................................... 91
PIC18F2331/2431/4331/4431
Preliminary
DS39616B-page 5