PIC16F688-I/P Microchip Technology, PIC16F688-I/P Datasheet - Page 163

IC PIC MCU FLASH 4KX14 14DIP

PIC16F688-I/P

Manufacturer Part Number
PIC16F688-I/P
Description
IC PIC MCU FLASH 4KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F688-I/P

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Data Rom Size
256 B
Height
3.3 mm
Length
19.05 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162066 - HEADER INTRFC MPLAB ICD2 20PINAC162061 - HEADER INTRFC MPLAB ICD2 20PINDM163029 - BOARD PICDEM FOR MECHATRONICSAC162056 - HEADER INTERFACE ICD2 16F688ACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F688-I/P
Manufacturer:
MICROCHIP
Quantity:
26
Part Number:
PIC16F688-I/P
Manufacturer:
MOT
Quantity:
61
Part Number:
PIC16F688-I/P
0
Company:
Part Number:
PIC16F688-I/P
Quantity:
10 000
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
B
p
c
n
45
Dimension Limits
E1
E
Units
A2
E1
A1
D
p
A
E
L
B
n
h
c
h
2
1
MIN
L
Preliminary
.053
.004
.228
.150
.337
.010
.016
.008
.014
.052
D
0
0
0
INCHES*
A1
NOM
A
.050
.056
.007
.236
.154
.342
.015
.033
.009
.017
.061
14
12
12
4
MAX
.069
.010
.244
.157
.347
.020
.050
.010
.020
.061
15
15
8
MIN
1.35
1.32
0.10
5.79
8.56
0.25
0.20
0.36
3.81
0.41
0
0
0
MILLIMETERS
NOM
PIC16F688
1.27
1.55
1.42
0.18
5.99
3.90
8.69
0.38
0.84
0.23
0.42
14
12
12
4
A2
DS41203B-page 161
MAX
1.75
1.55
0.25
6.20
3.99
1.27
0.25
8.81
0.51
0.51
15
15
8

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