D6417709SHF200BV Renesas Electronics America, D6417709SHF200BV Datasheet - Page 429

IC SUPER H MPU ROMLESS 208LQFP

D6417709SHF200BV

Manufacturer Part Number
D6417709SHF200BV
Description
IC SUPER H MPU ROMLESS 208LQFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7700r
Datasheet

Specifications of D6417709SHF200BV

Core Processor
SH-3
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
96
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.85 V ~ 2.15 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D6417709SHF200BV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
11.5
11.5.1
In this example, receive data of the on-chip IrDA is transferred to external memory using DMAC
channel 3. Table 11.8 shows the transfer conditions and register settings. In addition, it is
recommended that the trigger for the number of receive FIFO data bytes in IrDA be set to 1
(RTRG1 = RTRG0 = 0 in SCFCR).
Table 11.8 Transfer Conditions and Register Settings for Transfer between On-Chip SCI
Transfer Conditions
Transfer source: RDR1 of on-chip IrDA
Transfer destination: External memory
Number of transfers: 64
Transfer source address: Fixed
Transfer destination address: Incremented
Transfer request source: IrDA (RXI1)
Bus mode: Cycle-steal
Transfer unit: Byte
Interrupt request generated at end of transfer
Channel priority order: 0 > 2 > 3 > 1
Examples of Use
Example of DMA Transfer between On-Chip IrDA and External Memory
and External Memory
Register
SAR3
DAR3
DMATCR3
CHCR3
DMAOR
Rev. 5.00, 09/03, page 383 of 760
Setting
H'0400014A
H'00400000
H'00000040
H'00004B05
H'0101

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