HD64F3437TFI16V Renesas Electronics America, HD64F3437TFI16V Datasheet - Page 483

no-image

HD64F3437TFI16V

Manufacturer Part Number
HD64F3437TFI16V
Description
MCU FLASH 60K 100-TQFP
Manufacturer
Renesas Electronics America
Datasheet

Specifications of HD64F3437TFI16V

Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F3437TFI16V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
HD64F3437TFI16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
RAM Area Allocation in Boot Mode: In boot mode, the 96 bytes from H'F780 to H'F7DF and
the 18 bytes from H'FF6E to H'FF7F are reserved for use by the boot program, as shown in figure
20.6. The user program is transferred into the area from H'F7E0 to H'FF6D (1934 bytes). The boot
program area can be used after the transition to execution of the user program transferred into
RAM. If a stack area is needed, set it within the user program.
Note: * This area cannot be used until the H8/3437F starts to execute the user program
transferred to RAM (until it has branched to H’F7E0 in RAM). Note that even after the
branch to the user program, the boot program area (H'F780 to H'F7DF, H'FF6E to
H'FF7F) still contains the boot program.
Note also that 16 bytes (H'F780 to H'F78F) of this area cannot be used if an interrupt
handling routine is executed within the boot program. For details see section 20.4.9,
Interrupt Handling during Flash Memory Programming and Erasing.
Figure 20.6 RAM Areas in Boot Mode
H'F780
H'F7E0
H'FF6E
H'FF7F
area* (18 bytes)
Boot program
User program
Boot program
transfer area
(1934 bytes)
(96 bytes)
area*
451

Related parts for HD64F3437TFI16V