MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 528

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.14.2
A.14.2.1
528
Typical values are at 25°C.
1 BT = Bit Time = 100 ns
These parameters are the minimum and maximum times as specified in section 24.6 of the IEEE 802.3u Standard
Num
1
2
3
4
5
6
TXD
TXEN
COL
Auto Negotiation
MII – 100BASE-TX Transmit Timing Parameters
C
D
D
D
D
D
D
Table A-20. MII – Auto Negotiation and Fast Link Pulse Timing Parameters
TX+
Clock/data pulse width
Clock pulse to clock pulse
Clock pulse to data pulse (data = 1)
Pulses in a burst
FLP burst width
FLP burst to FLP burst
Figure A-7. Auto-Negotiation and Fast Link Pulse Timing
Clock Pulse
t1
Figure A-6. 10BASE-T SQE (Heartbeat) Timing
Parameter
t1
MC9S12NE64 Data Sheet, Rev. 1.1
t3
Data Pulse
t2
t1
Sym
t1
t2
t3
t4
t5
t6
Clock Pulse
55.5
Min
111
17
t2
8
62.5
Typ
100
125
16
2
Freescale Semiconductor
Max
69.5
139
33
24
Units
ms
ms
ns
µs
µs
#