MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 406

IC MCU 64K FLASH EEPROM 80-TQFP

MC9S12NE64VTUE

Manufacturer Part Number
MC9S12NE64VTUE
Description
IC MCU 64K FLASH EEPROM 80-TQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12NE64VTUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, Ethernet, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
38
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.375 V ~ 3.465 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
Processor Series
S12N
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
125 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
- 0.3 V to + 3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12NE64E, DEMO9S12NE64E
Minimum Operating Temperature
- 65 C
On-chip Adc
10 bit, 8 Channel
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
25MHz
Total Internal Ram Size
8KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.625/3.465V
Operating Supply Voltage (min)
2.357/2.375/3.135V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
TQFP
For Use With
EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Manufacturer:
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Quantity:
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Chapter 15 Multiplexed External Bus Interface (MEBIV3)
15.3.2.7
Read: Anytime when register is in the map
Write: Anytime when register is in the map
Data direction register E is associated with port E. For bits in port E that are configured as general-purpose
I/O lines, DDRE determines the primary direction of each of these pins. A 1 causes the associated bit to
be an output and a 0 causes the associated bit to be an input. Port E bit 1 (associated with IRQ) and bit 0
(associated with XIRQ) cannot be configured as outputs. Port E, bits 1 and 0, can be read regardless of
whether the alternate interrupt function is enabled. The value in a DDR bit also affects the source of data
for reads of the corresponding PORTE register. If the DDR bit is 0 (input) the buffered pin input state is
read. If the DDR bit is 1 (output) the associated port data register bit state is read.
This register is not in the on-chip memory map in expanded and special peripheral modes. Therefore, these
accesses will be echoed externally. Also, it is not in the map in expanded modes while the EME control bit
is set.
406
Reset
DDRE
Field
7:2
W
R
Bit 7
Data Direction Port E
0 Configure the corresponding I/O pin as an input
1 Configure the corresponding I/O pin as an output
Note: It is unwise to write PORTE and DDRE as a word access. If you are changing port E pins from inputs to
Data Direction Register E (DDRE)
0
7
outputs, the data may have extra transitions during the write. It is best to initialize PORTE before enabling
as outputs.
= Unimplemented or Reserved
6
0
6
Figure 15-11. Data Direction Register E (DDRE)
Table 15-5. DDRE Field Descriptions
MC9S12NE64 Data Sheet, Rev. 1.1
5
0
5
4
0
4
Description
3
0
3
Bit 2
0
2
Freescale Semiconductor
0
0
1
0
0
0

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