MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 356

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 12 Ethernet Physical Transceiver (EPHYV2)
RAN — Restart Auto-Negotiation
DPLX — Duplex Mode
COLTEST — Collision Test
12.3.3.2 Status Register
This register advertises the capabilities of the port to the MII.
Read: Anytime
Write: Writes have no effect
100T4 —100BASE-T4
100XFD —100BASE-TX Full-Duplex
356
MII Register Address 1 (%00001)
RESET:
The RAN bit determines when the A/N process can start processing.
This mode can be selected by either the auto-negotiation process or manual duplex selection. Manual
duplex selection is allowed only while the auto-negotiation process is disabled (ANE=0). While the
auto-negotiation process is enabled (ANE = 1), the state of DPLX has no effect on the link
configuration. While loopback mode is asserted (LOOPBACK =1), the value of DPLX will have no
effect on the PHY.
The collision test function will be enabled only if the loopback mode of operation is also selected
(LOOPBACK = 1).
W
This function is not implemented in the EPHY module.
R
1 = When auto-negotiation is enabled (ANE=1), the auto-negotiation process will be restarted.
0 = Normal operation.
1 = Indicates full-duplex mode
0 = Indicates half-duplex mode
1 = Forces the PHY to assert the MII_COL signal within 512 bit times from the assertion of
0 = Normal operation
1 = Indicates PHY supports 100BASE-T4 transmission
0 = Indicates the PHY does not support 100BASE-T4 transmission
1 = Indicates PHY supports 100BASE-TX full-duplex mode
0 = Indicates PHY does not support 100BASE-TX full-duplex mode
100
15
T4
0
After auto-negotiation indicates that it has been initialized, this bit is cleared. When bit ANE
is cleared to indicate auto-negotiation is disabled, RAN must also be 0.
MII_TXEN and de-assert MII_COL within 4 bit times of MII_TXEN being de-asserted.
= Unimplemented or Reserved
100X
14
FD
1
100X
13
HD
1
10T
12
FD
1
10T
11
HD
1
MC9S12NE64 Data Sheet, Rev. 1.1
Figure 12-7. Status Register
10
0
0
9
0
0
8
0
0
7
0
0
SUP
PRE
6
1
COMP
AN
5
0
REM
FLT
4
0
ABL
AN
Freescale Semiconductor
3
1
STST
LNK
2
0
JAB
DT
1
0
CAP
EX
0
1