MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 510

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.10 Supply Currents
This section describes the current consumption characteristics of the device as well as the
conditions for the measurements.
A.10.1 Measurement Conditions
All measurements are without output loads. Unless otherwise noted the currents are measured in
single chip mode, internal voltage regulator enabled and at 25 MHz bus frequency using a 25 MHz
oscillator.
A.10.2 Additional Remarks
In expanded modes the currents flowing in the system are highly dependent on the load at the
address, data and control signals as well as on the duty cycle of those signals. No generally
applicable numbers can be given. A very good estimate is to take the single chip currents and add
the currents due to the external loads.
1
510
Conditions are shown in Table A-4 unless otherwise noted
Num
When calculating power consumption, the additional current sunk by the PHY_TXN and PHY_TXP pins must be taken into
account. See Table A-8 for currents and voltages to use in the power calculations.
1
2
3
4
5
C
P
C
P
C
C
C
P
C
P
C
C
C
C
C
C
C
P
C
C
Run supply currents
Wait supply current
Pseudo stop current (RTI and COP enabled)
Pseudo stop current (RTI and COP disabled)
Stop current
Single chip, internal regulator enabled, EPHY auto negotiate
Single chip, internal regulator enabled, EPHY 100BASE-TX
Single chip, internal regulator enabled, EPHY 10BASE-T
Single chip, internal regulator enabled, EPHY disabled
Table A-7. Supply Current Characteristics
Rating
MC9S12NE64 Data Sheet, Rev. 1.1
All modules but EPHY enabled
All modules enabled
only RTI enabled
–40°C
105°C
–40°C
105°C
–40°C
105°C
27°C
85°C
27°C
85°C
27°C
85°C
1
1
1
Symbol Min
I
I
I
DDPS
DDPS
I
I
DDW
DDS
DD3
1000
1000
Typ
Freescale Semiconductor
600
600
160
160
700
700
400
500
60
60
Max
5000
5000
5000
285
265
185
270
750
400
200
65
50
5
Unit
mA
mA
µA
µA
µA