MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 41

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.2.1
The MC9S12NE64 is available in a 112-pin low-profile quad flat pack (LQFP) and in an 80-pin quad flat
pack (TQFP-EP). Most pins perform two or more functions, as described in this section.
Figure 1-4
1.2.1.1
Freescale Semiconductor
MII_RXCLK/KWG4/PG4
MII_TXCLK/KWH4/PH4
MII_RXER/KWG6/PG6
MII_RXD0/KWG0/PG0
MII_RXD1/KWG1/PG1
MII_RXD2/KWG2/PG2
MII_RXD3/KWG3/PG3
MII_RXDV/KWG5/PG5
MII_TXER/KWH6/PH6
MII_TXEN/KWH5/PH5
MII_TXD3/KWH3/PH3
MII_TXD2/KWH2/PH2
MII_TXD1/KWH1/PH1
MII_TXD0/KWH0/PH0
MII_MDIO/KWJ1/PJ1
MII_MDC/KWJ0/PJ0
MII_CRS/KWJ2/PJ2
MII_COL/KWJ3/PJ3
ADDR0/DATA0/PB0
ADDR1/DATA1/PB1
ADDR2/DATA2/PB2
ADDR3/DATA3/PB3
ADDR4/DATA4/PB4
ADDR5/DATA5/PB5
ADDR6/DATA6/PB6
ADDR7/DATA7/PB7
show the pin assignments.
Device Pinout
112-Pin LQFP
VDDX1
VSSX1
Figure 1-3. Pin Assignments in 112-Pin LQFP for MC9S12NE64
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Signals shown in Bold are not available on the 80-pin package
MC9S12NE64 Data Sheet, Rev 1.0
112-PIN LQFP
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
PL0/ACTLED
PL1/LNKLED
VDDR
PL2/SPDLED
PA7/ADDR15/DATA15
PA6/ADDR14/DATA14
PA5/ADDR13/DATA13
PA4/ADDR12/DATA12
PHY_VSSRX
PHY_VDDRX
PHY_RXN
PHY_RXP
PHY_VSSTX
PHY_TXN
PHY_TXP
PHY_VDDTX
PHY_VDDA
PHY_VSSA
PHY_RBIAS
VDD2
VSS2
PA3/ADDR11/DATA11
PA2/ADDR10/DATA10
PA1/ADDR9/DATA9
PA0/ADDR8/DATA8
PL3/DUPLED
PL4/COLLED
BKGD/MODC/TAGHI
Figure 1-3
Signal Description
and
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