MC9S12NE64VTUE Freescale Semiconductor, MC9S12NE64VTUE Datasheet - Page 360

• Manufacturer Part Number: MC9S12NE64VTUE
• Description: IC MCU 64K FLASH EEPROM 80-TQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64VTUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 38
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• Processor Series: S12N
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 125 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12NE64E, DEMO9S12NE64E
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.625/3.465V
• Operating Supply Voltage (min): 2.357/2.375/3.135V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: TQFP
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 12 Ethernet Physical Transceiver (EPHYV2)
TAF10HD — 10BASE-T Half-Duplex
12.3.3.6 Auto Negotiation Link Partner Ability (Base Page)
Figure 12-11
the MI and will be written by the auto-negotiation process when it receives a link code word advertising
the capabilities of the link partner. This register has a dual purpose: exchange of base page information as
shown in
MII Register Address 5 (%00101) (Base Page)
Read:
Write:
NXTP — Next Page
ACK — Acknowledge
RFLT — Remote Fault
FLCTL — Flow Control
TAF100T4 — 100BASE-T4 Full-Duplex
TAF100FD — 100BASE-TX Full-Duplex
360
RESET:
W
This function is not implemented in the EPHY.
R
1 = 10BASE-T half-duplex capable
0 = Not 10BASE-T half-duplex capable
1 = Link partner capable of sending next pages
0 = Link partner not capable of sending next pages
1 = Link Partner has received link code word
0 = Link Partner has not received link code word
1 = Remote fault
0 = No remote fault
1 = Advertises implementation of the optional MAC control sublayer and pause function as
0 = No MAC-based flow control
1 = Link partner is 100BASE-T4 capable
0 = Link partner is not 100BASE-T4 capable
1 = Link partner is 100BASE-TX full-duplex capable
0 = Link partner is not 100BASE-TX full-duplex capable
Figure
NXTP
15
specified in IEEE standard clause 31 and anex 31B of 802.3. Setting FLCTL has no effect on
the PHY.
X
shows the contents of the A/N link partner ability register. The register can only be read by
= Unimplemented or Reserved
ACK
12-11, and exchange of next page information as shown in
14
Figure 12-11. Auto Negotiation Link Partner Ability Register (Base Page)
X
RFLT
13
X
12
X
TAF[1:0]
11
X
MC9S12NE64 Data Sheet, Rev. 1.1
FCTL
10
X
100T4
TAF
X
9
100FD
TAF
X
8
100HD
TAF
X
7
10FD
TAF
X
6
10HD
TAF
X
5
Figure
X
4
SELECTORFIELD[4:0]
12-12.
X
3
Freescale Semiconductor
X
2
X
1
0
X