MT48H8M16LFB4-75:K Micron Technology Inc, MT48H8M16LFB4-75:K Datasheet - Page 8

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MT48H8M16LFB4-75:K

Manufacturer Part Number
MT48H8M16LFB4-75:K
Description
DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Series
-r
Datasheet

Specifications of MT48H8M16LFB4-75:K

Package
54VFBGA
Density
128 Mb
Address Bus Width
14 Bit
Operating Supply Voltage
1.8 V
Maximum Clock Rate
133 MHz
Maximum Random Access Time
8|5.4 ns
Operating Temperature
0 to 70 °C
Format - Memory
RAM
Memory Type
Mobile SDRAM
Memory Size
128M (8Mx16)
Speed
132MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Package / Case
54-VFBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48H8M16LFB4-75:K
Manufacturer:
MICRON
Quantity:
4 000
Part Number:
MT48H8M16LFB4-75:K
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT48H8M16LFB4-75:K TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
General Description
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
The 128Mb Mobile LPSDR is a high-speed CMOS, dynamic random access memory con-
taining 134,217,728 bits. It is internally configured as a quad-bank DRAM with a synchro-
nous interface (all signals are registered on the positive edge of the clock signal, CLK).
Each of the x16’s 33,554,432-bit banks is organized as 4096 rows by 512 columns by 16
bits. Each of the x32’s 33,554,432-bit banks is organized as 4096 rows by 256 columns by
32 bits.
Mobile LPSDR devices offer substantial advances in DRAM operating performance, in-
cluding the ability to synchronously burst data at a high data rate with automatic column-
address generation, the ability to interleave between internal banks to hide precharge
time, and the capability to randomly change column addresses on each clock cycle dur-
ing a burst access.
Note:
1. Throughout the data sheet, various figures and text refer to DQs as DQ. DQ should be
interpreted as any and all DQ collectively, unless specifically stated otherwise. Addition-
ally, the x16 is divided into two bytes: the lower byte and the upper byte. For the lower
byte (DQ[7:0]), DQM refers to LDQM. For the upper byte (DQ[15:8]), DQM refers to
UDQM. The x32 is divided into four bytes. For DQ[7:0], DQM refers to DQM0. For
DQ[15:8], DQM refers to DQM1. For DQ[23:16], DQM refers to DQM2, and for
DQ[31:24], DQM refers to DQM3.
2. Complete functionality is described throughout the document; any page or diagram
may have been simplified to convey a topic and may not be inclusive of all requirements.
3. Any specific requirement takes precedence over a general statement.
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
8
Micron Technology, Inc. reserves the right to change products or specifications without notice.
General Description
©2008 Micron Technology, Inc. All rights reserved.

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