MC9S12C64CFUE Freescale Semiconductor, MC9S12C64CFUE Datasheet - Page 179

• Manufacturer Part Number: MC9S12C64CFUE
• Description: IC MCU 64K FLASH 4K RAM 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C64CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 4 KB
• Interface Type: CAN/SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Package: 80PQFP
• Family Name: HCS12
• Maximum Speed: 25 MHz
• Operating Supply Voltage: 2.5|5 V
• Height: 2.4 mm
• Length: 14 mm
• Supply Voltage (max): 2.75 V, 5.5 V
• Supply Voltage (min): 2.35 V, 2.97 V
• Width: 14 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

6.4.6
The BDM communicates with external devices serially via the BKGD pin. During reset, this pin is a mode
select input which selects between normal and special modes of operation. After reset, this pin becomes
the dedicated serial interface pin for the BDM.
The BDM serial interface is timed using the clock selected by the CLKSW bit in the status register see
Section 6.3.2.1, “BDM Status Register
the following explanation.
The BDM serial interface uses a clocking scheme in which the external host generates a falling edge on
the BKGD pin to indicate the start of each bit time. This falling edge is sent for every bit whether data is
transmitted or received. Data is transferred most significant bit (MSB) first at 16 target clock cycles per
bit. The interface times out if 512 clock cycles occur between falling edges from the host.
The BKGD pin is a pseudo open-drain pin and has an weak on-chip active pull-up that is enabled at all
times. It is assumed that there is an external pull-up and that drivers connected to BKGD do not typically
drive the high level. Because R-C rise time could be unacceptably long, the target system and host provide
brief driven-high (speedup) pulses to drive BKGD to a logic 1. The source of this speedup pulse is the host
for transmit cases and the target for receive cases.
The timing for host-to-target is shown in
9. All four cases begin when the host drives the BKGD pin low to generate a falling edge. Because the host
and target are operating from separate clocks, it can take the target system up to one full clock cycle to
recognize this edge. The target measures delays from this perceived start of the bit time while the host
measures delays from the point it actually drove BKGD low to start the bit up to one target clock cycle
Freescale Semiconductor
HARDWARE
HARDWARE
FIRMWARE
FIRMWARE
TRACE
WRITE
WRITE
READ
READ
GO,
BDM Serial Interface
AT ∼16 TC/BIT
COMMAND
COMMAND
COMMAND
COMMAND
COMMAND
8 BITS
DELAY
44-BC
DELAY
64-BC
AT ∼16 TC/BIT
Figure 6-6. BDM Command Structure
ADDRESS
ADDRESS
16 BITS
DATA
MC9S12C-Family / MC9S12GC-Family
COMMAND
(BDMSTS).” This clock will be referred to as the target clock in
NEXT
DATA
Figure 6-7
Rev 01.24
DELAY
32-BC
and that of target-to-host in
Chapter 6 Background Debug Module (BDMV4) Block Description
150-BC
DELAY
COMMAND
COMMAND
NEXT
NEXT
DATA
AT ∼16 TC/BIT
16 BITS
DATA
BC = BUS CLOCK CYCLES
TC = TARGET CLOCK CYCLES
150-BC
DELAY
Figure 6-8
COMMAND
COMMAND
NEXT
NEXT
and
Figure 6-
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