MCP1631RD-MCC2 Microchip Technology, MCP1631RD-MCC2 Datasheet - Page 255
![REFERENCE DESIGN MCP1631HV](/photos/9/4/90424/mcp1631rd-mcc2_sml.jpg)
MCP1631RD-MCC2
Manufacturer Part Number
MCP1631RD-MCC2
Description
REFERENCE DESIGN MCP1631HV
Manufacturer
Microchip Technology
Datasheets
1.MCP1631VHVT-330EST.pdf
(34 pages)
2.MCP1631HV-330EST.pdf
(54 pages)
3.MCP1631RD-MCC2.pdf
(20 pages)
4.MCP1631RD-MCC2.pdf
(328 pages)
Specifications of MCP1631RD-MCC2
Main Purpose
Power Management, Battery Charger
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP1631HV, PIC16F883
Primary Attributes
1 ~ 2 Cell- Li-Ion, 1 ~ 5 Cell- NiCd/NiMH, 1 ~ 2 1W LEDs
Secondary Attributes
Status LEDs
Silicon Manufacturer
Microchip
Application Sub Type
Battery Charger
Kit Application Type
Power Management - Battery
Silicon Core Number
MCP1631HV, PIC16F883
Kit Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- MCP1631VHVT-330EST PDF datasheet
- MCP1631HV-330EST PDF datasheet #2
- MCP1631RD-MCC2 PDF datasheet #3
- MCP1631RD-MCC2 PDF datasheet #4
- Current page: 255 of 328
- Download datasheet (6Mb)
17.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F882/883/884/886/887
Typ.
47.2
24.4
45.8
60.2
80.2
89.4
24.7
20.0
14.5
23.8
23.9
20.0
150
29
29
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41291F-page 253
OH
* (V
DD
- V
OH
))
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