SC16IS740IPW PHILIPS [NXP Semiconductors], SC16IS740IPW Datasheet - Page 55

• Manufacturer Part Number: SC16IS740IPW
• Description: Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
Fig 42. Package outline SOT616-3 (HVQFN24)
SC16IS740_750_760_5
Product data sheet
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT616-3
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
6
1
b
- - -
IEC
0.2
c
7
24
e
D
4.1
3.9
(1)
2.75
2.45
D h
e 1
D h
0
D
MO-220
JEDEC
1/2
E
4.1
3.9
e
(1)
b
REFERENCES
Rev. 05 — 16 November 2006
Single UART with I
19
2.75
2.45
E h
12
0.5
e
13
18
JEITA
scale
- - -
B
2.5
1/2
e
e
w
v
2.5
e 1
E
A
M
M
e 2
C
C
2.5
e 2
2
A
C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
B
0.5
0.3
L
SC16IS740/750/760
5 mm
0.1
A
v
y 1 C
A 1
0.05
w
PROJECTION
EUROPEAN
0.05
detail X
y
0.1
y 1
X
C
y
© NXP B.V. 2006. All rights reserved.
ISSUE DATE
04-11-19
05-03-10
c
SOT616-3
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