TFA9881_1104 PHILIPS [NXP Semiconductors], TFA9881_1104 Datasheet

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TFA9881_1104

Manufacturer Part Number
TFA9881_1104
Description
3.4 W PDM input class-D audio amplifier
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1. General description
2. Features and benefits
The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP (Wafer
Level Chip-Size Package) with a 400 μm pitch.
The digital input interface is an over-sampled Pulse Density Modulated (PDM) bit stream.
The TFA9881 receives audio and control settings via this interface. Dedicated silence
patterns are used to configure the control settings of the device, such as mute, gain, Pulse
Width Modulated (PWM) output slope, clip control and bandwidth extension (this control
mechanism is not required if the default settings are used). The Power-down to Operating
mode transition is triggered when a clock signal is detected.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in the TFA9881
provides excellent audio performance and high supply voltage ripple rejection.
TFA9881
3.4 W PDM input class-D audio amplifier
Rev. 2 — 1 April 2011
Small outline WLCSP9 package: 1.3 × 1.3 × 0.6 mm
Wide supply voltage range (fully operational from 2.5 V to 5.5 V)
High efficiency (90 %, 4 Ω/20 μH load) and low power dissipation
Quiescent power:
Output power:
Output noise voltage: 24 μV (A-weighted)
Signal-to-noise ratio: 103 dB (V
Fully short-circuit proof across load and to supply lines
Current limiting to avoid audio holes
Thermally protected
Undervoltage and overvoltage protection
High-pass filter for DC blocking
Invalid data protection
Simple two-wire interface for audio and control settings
Left/right selection
Three gain settings: −3 dB, 0 dB and +3 dB
PWM output slope setting for EMI reduction
6.5 mW (V
7.8 mW (V
1.4 W into 4 Ω at 3.6 V supply (THD = 1 %)
2.7 W into 4 Ω at 5.0 V supply (THD = 1 %)
3.4 W into 4 Ω at 5.0 V supply (THD = 10 %)
DDD
DDD
= 1.8 V, V
= 1.8 V, V
DDP
DDP
DDP
= 3.6 V, 4 Ω/20 μH load, f
= 3.6 V, 4 Ω/20 μH load, f
= 5 V, A-weighted)
clk
clk
= 2.048 MHz)
= 6.144 MHz)
Product data sheet

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TFA9881_1104 Summary of contents

Page 1

TFA9881 3.4 W PDM input class-D audio amplifier Rev. 2 — 1 April 2011 1. General description The TFA9881 is a mono, filter-free class-D audio amplifier in a 9-bump WLCSP (Wafer Level Chip-Size Package) with a 400 μm pitch. The ...

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NXP Semiconductors Bandwidth extension to support low sampling frequencies Clip control for smooth clipping Mute mode ‘Pop noise' free at all mode transitions Short power-up time Short power-down time: 5 μs 1.8 V/3.3 V tolerant digital inputs Low ...

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NXP Semiconductors 5. Ordering information Table 2. Ordering information Type number Package Name TFA9881UK WLCSP9 6. Block diagram Fig 1. TFA9881 Product data sheet Description wafer level chip-size package; 9 bumps; 1.3 x 1 DDD B1 ...

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NXP Semiconductors 7. Pinning information 7.1 Pinning TFA9881 bump A1 index area Bottom view Fig 2. Bump configuration for WLCSP9 (bottom view) Fig 4. 7.2 Pin description Table 3. Symbol DATA LRSEL OUTB V DDD V ...

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NXP Semiconductors 8. Functional description The TFA9881 is a high-efficiency mono Bridge Tied Load (BTL) class-D audio amplifier with a digital stereo PDM input interface. A High-Pass (HP) filter removes the DC components from the incoming PDM stream. This stream ...

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NXP Semiconductors Fig 5. Table 5. LRSEL pin state LOW HIGH 8.3 Power up/down sequence The TFA9881 power-up/power-down sequence is shown in supplies V switches to Operating mode. The TFA9881 should be switched to Power-down mode before the power supplies ...

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NXP Semiconductors 8.4 Control settings Control settings are not needed if the default values are adequate. 8.4.1 Silence pattern recognition The TFA9881 can detect control settings on the PDM input by means of silence pattern recognition. A silence pattern has ...

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NXP Semiconductors Table 7. Byte 0xE4 0xAA [2] 0x66 [2] 0xAC [1] The related bytes are the bytes from the first column phase shifted and 7 bits. [2] A silence pattern containing this ...

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NXP Semiconductors Table 10. Setting slope low slope normal; default setting 8.4.5 Dynamic Power Stage Activation (DPSA) The TFA9881 uses DPSA to regulate current consumption in line with the level of the incoming audio stream. This function switches off power ...

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NXP Semiconductors corner frequency where the noise is increasing. The bandwidth in clock input frequency. This bandwidth can be extended via the bandwidth extension silence pattern (0xE4; see the bandwidth extension setting. The bandwidth and the PWM switching frequency when ...

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NXP Semiconductors 8.5 High-pass filter The high-pass filter will block the DC components in the incoming audio stream. The cut-off frequency, f Equation f – ( high 3dB where k depends on the bandwidth extension setting (see • ...

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NXP Semiconductors 8.6.3 Supply voltage protection mechanisms (UVP and OVP) UVP is activated, setting the outputs floating protection threshold, V supply voltage rises above 6.144 MHz. clk OVP is activated, setting the power stages floating, ...

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NXP Semiconductors 9. Internal circuitry Table 13. Internal circuitry Pin Symbol A1 DATA C1 CLK B1 V DDD B2 V DDP A2 LRSEL C2 TEST A3 OUTB C3 OUTA TFA9881 Product data sheet Equivalent circuit A1 B1, B2 ...

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NXP Semiconductors 10. Limiting values Table 14. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V power supply voltage DDP V digital supply voltage DDD T junction temperature j T storage temperature stg T ...

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NXP Semiconductors 12. Characteristics 12.1 DC characteristics Table 16. DC characteristics All parameters are guaranteed for V ° default settings, unless otherwise specified. amb Symbol Parameter V power supply voltage DDP V digital supply voltage DDD ...

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NXP Semiconductors 12.2 AC characteristics Table 17. AC characteristics All parameters are guaranteed for V ° default settings, unless otherwise specified. amb Symbol Parameter Output power P RMS output power o(RMS) Performance η output power efficiency ...

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NXP Semiconductors 12.3 PDM timing characteristics Table 18. PDM timing characteristics All parameters are guaranteed for V ° default settings, unless otherwise specified. amb Symbol Parameter f clock frequency clk δ clock duty cycle clk t ...

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NXP Semiconductors 13. Application information 13.1 ElectroMagnetic Compatibility (EMC) EMC standards define to what degree a (sub)system is susceptible to externally imposed electromagnetic influences and to what degree a (sub)system is responsible for emitting electromagnetic signals, when in Standby mode ...

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NXP Semiconductors 13.3 Typical application diagram (simplified) BASEBAND PROCESSOR PDM output Fig 10. Typical stereo application (simplified) TFA9881 Product data sheet A2 C2 DATA A1 CLK TFA9881UK C1 V DDD 1 CVDDD 100 DATA ...

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NXP Semiconductors 13.4 Curves measured in reference design (demonstration board) All measurements were taken with V off and slope normal, unless otherwise specified THD+N (%) 10 1 −1 10 −2 10 −3 10 −3 −2 − ...

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NXP Semiconductors 10 THD+N (%) 1 −1 10 (1) −2 10 (2) − ( 500 mW 100 mW Ω 3.6 V, ...

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NXP Semiconductors 10 THD+N+IMD (%) 1 −1 10 −2 10 − ( Hz). ripple ripple ( 217 Hz. ripple ( kHz. ripple ...

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NXP Semiconductors (1) A-weighted. (2) 20 kHz brickwall filter. Fig 16. S/N ratio as a function of output power ( Ω, L (1) THD ...

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NXP Semiconductors 0.15 P (W) 0.10 0.05 0 −3 −2 − ( 3.6 V. DDP ( DDP = 8 Ω μ Fig 18. ...

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NXP Semiconductors 14. Package outline WLCSP9: wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm bump A1 index area bump A1 1 index area Dimensions Unit max ...

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NXP Semiconductors 15. Soldering of WLCSP packages 15.1 Introduction to soldering WLCSP packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application ...

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NXP Semiconductors Fig 21. Temperature profiles for large and small components For further information on temperature profiles, refer to application note AN10365 “Surface mount reflow soldering description”. 15.3.1 Stand off The stand off between the substrate and the chip is ...

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NXP Semiconductors Device removal can be done when the substrate is heated until it is certain that all solder joints are molten. The chip can then be carefully removed from the substrate without damaging the tracks and solder lands on ...

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NXP Semiconductors 16. Revision history Table 20. Revision history Document ID Release date TFA9881 v.2 20110401 • Modifications: Data sheet status changed to ‘Product data sheet’ • Table TFA9881 v.1 20110105 TFA9881 Product data sheet Data sheet status Product data ...

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NXP Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified ...

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NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...

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