at91cap7e ATMEL Corporation, at91cap7e Datasheet - Page 499

• Manufacturer Part Number: at91cap7e
• Description: Customizable Microcontroller
• Manufacturer: ATMEL Corporation

34. AT91CAP7E Mechanical Characteristics
34.1
34.1.1
Table 34-1.
34.1.2
8549A–CAP–10/08
Symbol
θ
θ
JA
JC
Thermal Considerations
Thermal Data
Junction Temperature
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Thermal Resistance Data
Table 34-1
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
4.
5.
• θ
• θ
• θ
• P
• T
page
Table 34-1 on page
”Power Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
J
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
=
499.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
+
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
499.
JA
Condition
Still Air
Still Air
)
+
θ
482.
JC
) )
13x13mm 0.8mm pitch
13x13mm 0.8mm pitch
J
, in °C can be obtained from the following:
LFBGA 225
LFBGA 225
Package
35.3
Typ
28
AT91CAP7E
Table 34-1 on
°C/W
°C/W
Unit
Section 33.3
J
in °C.
499