pnx1700 NXP Semiconductors, pnx1700 Datasheet - Page 215
pnx1700
Manufacturer Part Number
pnx1700
Description
Connected Media Processor
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1700.pdf
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Philips Semiconductors
Volume 1 of 1
PNX17XX_SER_1
Preliminary data sheet
Figure 2:
0xFFFF,FFFF
0x2000_0000
0x1C00_0000
0x1BE0_0000
0x0XX0_0000
0x0000_0000
System Memory Map and Block Diagram Configuration for PNX17xx Series in Standalone Mode
3.2 The Specifics of the Boot From Flash Memory Devices
8-256 MB DRAM
In standalone mode PNX17xx Series fetches its TM5250 binary program and data
from a Flash memory device. The PCI module has internal DMA logic that allows,
with few MMIO register writes, to autonomously fetch data from Flash memory
devices (connected to the PCI-XIO bus) to the main memory. The typical simplified
board system is sketched in
same
(resistor pull-up or -down) on the BOOT_MODE[6:4] pins. The Flash memory device
used for boot must be connected and therefore selectable by the XIO_SEL0 pin.
In order to be able to access the content of the Flash memory devices the following
actions are taken in the boot scripts:
1. The XIO_ACK and the XIO_D[15:8] are removed from their reset state that sets
2. The PCI module DMA is configured depending on the BOOT_MODE[2:0] pin
2 MB MMIO
64 MB XIO
them as GPIO pins. This is done whether the connected Flash memory device is
8- or 16-bit wide.
value. Based on the values of these pins the PCI module knows the width and
type of the Flash memory device.
access the two types of Flash memory devices. The XIO Sel0 Profile MMIO
Unused
Unused
Figure
2. The size of the DRAM is programmable with bootstrap options
Rev. 1 — 17 March 2006
Figure
2. The aperture settings are also presented in the
PCI-XIO Bus
PCI Agent/Slave
Table 7
describes the different settings used to
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
8- or 16-bit NAND or
NOR FLASH/ROM
BOOT_MODE[7:0]
Chapter 6: Boot Module
DDR SDRAM
PNX17xx
XIO_SEL0
6-10
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