adc12d800rfrb National Semiconductor Corporation, adc12d800rfrb Datasheet - Page 48

• Manufacturer Part Number: adc12d800rfrb
• Description: 12-bit, 1.6/1.0 Gsps Rf Sampling Adc
• Manufacturer: National Semiconductor Corporation

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17.5.5 Thermal Management
The Heat Slug Ball Grid Array (HSBGA) package is a modified
version of the industry standard plastic BGA (Ball Grid Array)
package. Inside the package, a copper heat spreader cap is
The center balls are connected to the bottom of the die by vias
in the package substrate,
resistance between the die and these balls. Connecting these
balls to the PCB ground planes with a low thermal resistance
Figure
21. This gives a low thermal
FIGURE 20. Power and Grounding Example
FIGURE 21. HSBGA Conceptual Drawing
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attached to the substrate top with exposed metal in the center
top area of the package. This results in a 20% improvement
(typical) in thermal performance over the standard plastic
BGA package.
path is the best way dissipate the heat from the ADC. These
pins should also be connected to the ground plane via a low
impedance path for electrical purposes. The direct connection
to the ground planes is an easy method to spread heat away
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