MT55L1MY18F Micron Semiconductor Products, Inc., MT55L1MY18F Datasheet - Page 33

• Manufacturer Part Number: MT55L1MY18F
• Description: 18Mb ZBT SRAM, 3.3V Vdd, 2.5V or 3.3V I/O; 2.5V Vdd, 2.5V I/O, Flow-Through,
• Manufacturer: Micron Semiconductor Products, Inc.

NOTE:
Data Sheet Designation
supply and temperature range for production devices. Although considered final, these specifications are sub-
ject to change, as further product development and data characterization sometimes occur.
18Mb: 1 Meg x 18, 512K x 32/36 Flow-through ZBT SRAM
MT55L1MY18F_16_D.fm – Rev. D, Pub. 2/03
SOLDER BALL DIAMETER REFERS
TO POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS Ø 0.40
1. All dimensions in inches (millimeters)
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc., and the architecture is supported by Micron Technology, Inc.,
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
No Marking: This data sheet contains minimum and maximum limits specified over the complete power
15.00 ±0.10
165X Ø 0.45
BALL A11
7.50 ±0.05
7.00 ±0.05
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.85 ±0.075
5.00 ±0.05
13.00 ±0.10
10.00
MAX
------------- -
MIN
6.50 ±0.05
1.00
TYP
or typical where noted.
165-Ball FBGA
and Motorola, Inc.
Figure 21:
C
1.00
TYP
BALL A1
PIN A1 ID
33
14.00
SEATING PLANE
0.12 C
18Mb: 1 MEG x 18, 512K x 32/36
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
FLOW-THROUGH ZBT SRAM
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2003 Micron Technology, Inc.