ST72561J9-Auto STMicroelectronics, ST72561J9-Auto Datasheet - Page 304

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ST72561J9-Auto

Manufacturer Part Number
ST72561J9-Auto
Description
8-bit MCU for automotive
Manufacturer
STMicroelectronics
Datasheet

Specifications of ST72561J9-Auto

Hdflash Endurance
100 cycles, data retention 20 years at 55 °C
5 Power Saving Modes
halt, auto wake up from halt, active halt, wait and slow
Package characteristics
Figure 150. 64-pin low profile quad flat package (10 x10)
21.3
21.4
304/324
Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Packaging for automatic handling
The devices can be supplied in trays or with tape and reel conditioning.
Tape and reel conditioning can be ordered with pin 1 left-oriented or right-oriented when
facing the tape sprocket holes as shown in
of an application can be defined by the user with the formula: P
internal power (I
application.
D1
D
Symbol
T
R
Jmax
P
thJA
D
DD
x V
Package thermal resistance (junction to
ambient)
LQFP64
LQFP44
LQFP32
Power dissipation
Maximum junction temperature
DD
E1
) and P
E
PORT
Doc ID 12370 Rev 8
L1
is the port power dissipation depending on the ports used in the
(1)
b
e
L
Ratings
A1
A2
A
θ
Figure
c
(2)
Dim.
D1
A1
A2
E1
L1
A
D
E
N
b
c
e
q
L
151.
0.05
1.35
0.17
0.09
0.45
D
D
Min
= (T
= P
INT
J
12.00
10.00
12.00
10.00
1.40
0.22
0.50
0.60
1.00
3.5°
Typ
mm
- T
+ P
A
) / R
PORT
Max
1.60
0.15
1.45
0.27
0.20
0.75
Number of Pins
thJA
where P
. The power dissipation
Value
64
0.002
0.053
0.007
0.004
0.018
500
150
Min
60
52
70
INT
ST72561-Auto
inches
0.055
0.009
0.472
0.394
0.472
0.394
0.020
0.024
0.039
is the chip
Typ
3.5°
°C/W
0.063
0.006
0.057
0.011
0.008
0.030
Unit
Max
mW
°C

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