ST7232AK2-Auto STMicroelectronics, ST7232AK2-Auto Datasheet - Page 184

• Manufacturer Part Number: ST7232AK2-Auto
• Description: 8-bit MCU for automotive, 16 Kbyte Flash, 10-bit ADC, 4 timers, SPI, SCI
• Manufacturer: STMicroelectronics

Specifications of ST7232AK2-Auto

• Hdflash Endurance: 100 cycles, data retention
• Clock Sources: crystal/ceramic resonator oscillators and bypass for external clock
• Four Power Saving Modes: halt, active halt, wait and slow
• Main Clock Controller With: real time base, beep and clock-out capabilities
• Two 16-bit Timers With: 2 input captures, 2 output compares, PWM and pulse generator modes

Package characteristics
13.2
13.3
184/201
Thermal characteristics
Table 97.
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering information
In order to meet environmental requirements, ST offers these devices in ECOPACK® pack-
ages. These packages have a lead-free second level interconnect. The category of second
level interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.
Compatibility
ECOPACK® LQFP packages are fully compatible with Lead (Pb) containing soldering
process (see application note AN2034).
Table 98.
LQFP32
LQFP44
Symbol
an application can be defined by the user with the formula: P
internal power (I
application.
T
R
Package
P
Jmax
thJA
D
Thermal characteristics
Package thermal resistance (junction to ambient)
LQFP32
LQFP44
Power dissipation
Maximum junction temperature
Soldering compatibility (wave and reflow soldering process)
DD
NiPdAu (Nickel-Palladium-Gold)
Sn (pure Tin)
x V
DD
Plating material devices
) and P
(1)
PORT
is the port power dissipation depending on the ports used in the
Ratings
(2)
D
Pb solder paste
= P
D
= (T
INT
Yes
J
+ P
-T
A
PORT
)/R
thJA
where P
. The power dissipation of
Pb-free solder paste
Value
500
150
70
52
INT
ST7232Axx-Auto
is the chip
Yes
°C/W
Unit
mW
°C