SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 566

• Manufacturer Part Number: SAM9G10
• Manufacturer: Atmel Corporation

Specifications of SAM9G10

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 266 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 4
• Ssc: 3
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 16
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

35.7.4
568
SAM9G10
Write Operation
In write operation, the MCI Mode Register (MCI_MR) is used to define the padding value when
writing non-multiple block size. If the bit PDCPADV is 0, then 0x00 value is used when padding
data, otherwise 0xFF is used.
If set, the bit PDCMODE enables PDC transfer.
The following flowchart shows how to write a single block with or without use of PDC facilities
(see
to the contents of the Interrupt Mask Register (MCI_IMR).
Figure
35-9). Polling or interrupt method can be used to wait for the end of write according
6462B–ATARM–6-Sep-11