SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 208

no-image

SAM9G10

Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G10

Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
Figure 23-4. Read Burst with Boundary Row Access
23.5.4
208
SDRAMC_A[12:0]
D[31:0]
SDWE
SDCS
SDCK
RAS
CAS
SAM9G10
SDRAM Controller Refresh Cycles
col a
Row n
col b
Dna
An auto-refresh command is used to refresh the SDRAM device. Refresh addresses are gener-
ated internally by the SDRAM device and incremented after each auto-refresh automatically.
The SDRAM Controller generates these auto-refresh commands periodically. An internal timer is
loaded with the value in the register SDRAMC_TR that indicates the number of clock cycles
between refresh cycles.
A refresh error interrupt is generated when the previous auto-refresh command did not perform.
It is acknowledged by reading the Interrupt Status Register (SDRAMC_ISR).
When the SDRAM Controller initiates a refresh of the SDRAM device, internal memory accesses
are not delayed. However, if the CPU tries to access the SDRAM, the slave indicates that the
device is busy and the master is held by a wait signal. See
col c
Dnb
col d
Dnc
Dnd
T
RP
= 3
Row m
T
RCD
= 3
col a
CAS = 2
Figure
col b
Dma
col c
23-5.
Dmb
col d
Dmc
col e
6462B–ATARM–6-Sep-11
Dmd
Dme

Related parts for SAM9G10