SAM3U4E Atmel Corporation, SAM3U4E Datasheet - Page 971
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SAM3U4E
Manufacturer Part Number
SAM3U4E
Description
Manufacturer
Atmel Corporation
Specifications of SAM3U4E
Flash (kbytes)
256 Kbytes
Pin Count
144
Max. Operating Frequency
96 MHz
Cpu
Cortex-M3
# Of Touch Channels
57
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
5
Twi (i2c)
2
Uart
5
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
50
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
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Figure 39-14. Data OUT Transfer for an Endpoint with Two Banks
39.6.9.13
Figure 39-15. Bank Management, Example of Three Transactions per Microframe
6430E–ATARM–29-Aug-11
6430E–ATARM–29-Aug-11
USB Bus
Packets
Virtual RX_BK_RDY
Bank 0
Virtual RX_BK_RDY
Bank 1
RX_BK_RDY = (virtual bank 0 | virtual bank 1)
(UDPHS_EPTSTAx)
FIFO (DPR)
Bank 0
FIFO (DPR)
Bank 1
USB bus
Transactions
Microcontroller FIFO
(DPR) Access
t = 0
High Bandwidth Isochronous Endpoint OUT
Host sends first data payload
Token OUT
Set by Hardware,
Data payload written
in FIFO endpoint bank 0
MDATA0
RX_BK_RDY
Write by UDPHS Device
USB 2.0 supports individual High Speed isochronous endpoints that require data rates up to 192
Mb/s (24 MB/s): 3x1024 data bytes per microframe.
To support such a rate, two or three banks may be used to buffer the three consecutive data
packets. The microcontroller (or the DMA) should be able to empty the banks very rapidly (at
least 24 MB/s on average).
NB_TRANS field in UDPHS_EPTCFGx register = Number Of Transactions per Microframe.
If NB_TRANS > 1 then it is High Bandwidth.
Example:
MDATA1
Data OUT 1
Data OUT 1
Read Bank 1
DATA2
ACK
Read by Microcontroller
Set by Hardware
Data Payload written
in FIFO endpoint bank 1
t = 52.5 μs
(40% of 125 μs)
Interrupt pending
Microcontroller reads Data 1 in bank 0,
Host sends second data payload
Data OUT 1
Token OUT
Read Bank 2
Write by Hardware
Data OUT 2
Data OUT 2
Cleared by Firmware
Read Bank 3
ACK
t = 125 μs
Token OUT
Read by Microcontroller
Microcontroller reads Data 2 in bank 1,
Host sends third data payload
MDATA0
Interrupt pending
Data OUT 2
RX_BK_RDY
Write in progress
Data OUT 3
SAM3U Series
SAM3U Series
Data OUT 3
MDATA1
Read Bank 1
Cleared by Firmware
USB line
DATA2
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971
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