LPC1857FET256,551 NXP Semiconductors, LPC1857FET256,551 Datasheet - Page 996
LPC1857FET256,551
Manufacturer Part Number
LPC1857FET256,551
Description
IC MCU 32BIT 1MB FLASH 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1857FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1857FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 996 of 1164
- Download datasheet (8Mb)
NXP Semiconductors
<Document ID>
User manual
XTAL1
Fig 153. Oscillator modes and models: a) slave mode of operation, b) oscillation mode of operation, c) external
crystal model used for C
LPC18xx
C
Clock
C
XTAL2
a)
Table 946. Recommended values for C
Fundamental oscillation
frequency F
2 MHz
4 MHz
8 MHz
12 MHz
16 MHz
20 MHz
•
External components and models used in oscillation mode are shown in
drawings b and c, and in
integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be
connected externally in case of fundamental mode oscillation (the fundamental
frequency is represented by L, CL and RS). Capacitance C
represents the parallel package capacitance and should not be larger than 7 pF.
Parameters FC, CL, RS and CP are supplied by the crystal manufacturer.
X1
components parameters) low frequency mode
OSC
/
X2
XTAL1
evaluation
All information provided in this document is subject to legal disclaimers.
C
X1
Rev. 00.13 — 20 July 2011
LPC18xx
Xtal
XTAL2
b)
Table 946
Maximum crystal series
resistance R
< 200
< 200
< 200
< 200
< 200
< 200
< 200
< 200
< 160
< 160
< 120
< 80
<100
< 80
X1/X2
C
X2
and
in oscillation mode (crystal and external
Table
S
947. Since the feedback resistance is
< = >
External load capacitors
C
33 pF, 33 pF
39 pF, 39 pF
56 pF, 56 pF
18 pF, 18 pF
39 pF, 39 pF
56 pF, 56 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
39 pF, 39 pF
18 pF, 18 pF
33 pF, 33 pF
18 pF, 18 pF
33 pF, 33 pF
P
X1
in
c)
, C
Chapter 42: Appendix
Figure
X2
UM10430
© NXP B.V. 2011. All rights reserved.
153, drawing c,
L
C
R
L
S
Figure
996 of 1164
153,
C
P
Related parts for LPC1857FET256,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: