LPC1857FET256,551 NXP Semiconductors, LPC1857FET256,551 Datasheet - Page 334
LPC1857FET256,551
Manufacturer Part Number
LPC1857FET256,551
Description
IC MCU 32BIT 1MB FLASH 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheets
1.LPC1830FET256551.pdf
(87 pages)
2.LPC1810FET100551.pdf
(2 pages)
3.LPC1810FET100551.pdf
(1164 pages)
Specifications of LPC1857FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
136K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1857FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 334 of 1164
- Download datasheet (8Mb)
NXP Semiconductors
<Document ID>
User manual
19.7.12 Dynamic Memory Write Recovery Time register
19.7.13 Dynamic Memory Active to Active Command Period register
19.7.11 Dynamic Memory Data In to Active Command Time register
The DynamicTDAL register enables you to program the data-in to active command time,
tDAL. It is recommended that this register is modified during system initialization, or when
there are no current or outstanding transactions. This can be ensured by waiting until the
EMC is idle, and then entering low-power, or disabled mode. This value is normally found
in SDRAM data sheets as tDAL, or tAPW. This register is accessed with one wait state.
Note: This register is used for all four dynamic memory chip selects. Therefore the worst
case value for all of the chip selects must be programmed.
Table 276. Dynamic Memory Data In to Active Command Time register (DYNAMICDAL -
The DynamicTWR register enables you to program the write recovery time, tWR. It is
recommended that this register is modified during system initialization, or when there are
no current or outstanding transactions. This can be ensured by waiting until the EMC is
idle, and then entering low-power, or disabled mode. This value is normally found in
SDRAM data sheets as tWR, tDPL, tRWL, or tRDL. This register is accessed with one
wait state.
Note: This register is used for all four dynamic memory chip selects. Therefore the worst
case value for all of the chip selects must be programmed.
Table 277. Dynamic Memory Write Recovery Time register (DYNAMICWR - address
The DynamicTRC register enables you to program the active to active command period,
tRC. It is recommended that this register is modified during system initialization, or when
there are no current or outstanding transactions. This can be ensured by waiting until the
EMC is idle, and then entering low-power, or disabled mode. This value is normally found
in SDRAM data sheets as tRC. This register is accessed with one wait state.
Note: This register is used for all four dynamic memory chip selects. Therefore the worst
case value for all of the chip selects must be programmed.
Bit
3:0
31:4
Bit
3:0
31:4
Symbol Description
tDAL
-
Symbol Description
tWR
-
address 0x4000 5040) bit description
0x4000 5044) bit description
All information provided in this document is subject to legal disclaimers.
Data-in to active command.
0x0 - 0xE = n clock cycles. The delay is in CCLK cycles.
0xF = 15 clock cycles (POR reset value).
Reserved, user software should not write ones to reserved bits. The
value read from a reserved bit is not defined.
Write recovery time.
0x0 - 0xE = n + 1 clock cycles. The delay is in CCLK cycles.
0xF = 16 clock cycles (POR reset value).
Reserved, user software should not write ones to reserved bits. The
value read from a reserved bit is not defined.
Rev. 00.13 — 20 July 2011
Chapter 19: LPC18xx External Memory Controller (EMC)
UM10430
© NXP B.V. 2011. All rights reserved.
334 of 1164
Reset
value
0xF
-
Reset
value
0xF
-
Related parts for LPC1857FET256,551
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: