JS28F512P33BFD Micron Technology Inc, JS28F512P33BFD Datasheet - Page 10

• Manufacturer Part Number: JS28F512P33BFD
• Manufacturer: Micron Technology Inc

Specifications of JS28F512P33BFD

• Cell Type: NOR
• Density: 512Mb
• Access Time (max): 105/17ns
• Interface Type: Parallel/Serial
• Boot Type: Bottom
• Address Bus: 25b
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 32M
• Supply Current: 31mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / RoHS Status: Supplier Unconfirmed

Table 2:
2.2
Figure 4:
Table 3:
Datasheet
12
Product Information
Lead Count
Lead Tip Angle
Seating Plane Coplanarity
Lead to Package Offset
Notes:
1.
2.
3.
Product Information
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
TSOP Package Dimensions (Sheet 2 of 2)
Easy BGA Mechanical Specifications (8x10x1.2 mm)
Easy BGA Package Dimensions for 8x10x1.2 mm (Sheet 1 of 2)
Ball A1
Corner
E
64-Ball Easy BGA Package (512-Mbit, 1-Gbit, 2-Gbit)
A2
B
C
D
E
F
G
H
A
1
Symbol
2
A1
Top View - Ball side down
N
Y
Z
θ
3
4
D
Symbol
5
0.150
Min
A1
A2
0°
A
b
D
-
-
6
7
Millimeters
0.250
0.330
9.900
8
Min
0.250
Nom
-
-
56
3°
-
Millimeters
A
10.000
A
B
C
D
F
G
H
0.780
0.430
E
Nom
-
-
0.100
0.350
8
Max
5°
Seating
Plane
-
7
Bottom View - Ball Side Up
10.100
1.200
0.530
6
Max
-
-
0.006
5
Min
0°
-
-
4
Note: Drawing not to scale
0.0098
0.0130
0.3898
Min
3
-
-
Inches
2
0.010
Nom
56
3°
-
Inches
1
0.0307
0.0169
0.3937
Nom
Y
S1
Order Number: 208043-05
-
-
Ball A1
Corner
0.004
0.014
Max
b
e
5°
-
S2
0.0472
0.0209
0.3976
Max
-
-
P33-65nm
Apr 2010