UJA1065 NXP Semiconductors, UJA1065 Datasheet - Page 68
UJA1065
Manufacturer Part Number
UJA1065
Description
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1065.pdf
(76 pages)
Specifications of UJA1065
Lead Free Status / RoHS Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UJA1065/5V0
Manufacturer:
SIPEX
Quantity:
11
Company:
Part Number:
UJA1065TW/3V3
Manufacturer:
NXP
Quantity:
4 798
Part Number:
UJA1065TW/3V3
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Part Number:
UJA1065TW/5V0
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
UJA1065TW/5V0/C/T
Manufacturer:
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Quantity:
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Part Number:
UJA1065TW/5V0/C/T,
Manufacturer:
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Quantity:
20 000
Part Number:
UJA1065TW/5VO/C/T
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
68 of 76
A