HC230F1020 Altera, HC230F1020 Datasheet - Page 6

• Manufacturer Part Number: HC230F1020
• Manufacturer: Altera

Specifications of HC230F1020

• Lead Free Status / RoHS Status: Not Compliant

HardCopy Series Handbook, Volume 1
Migration and
Packaging
Overview
1–4
Preliminary
Notes to
(1)
(2)
HC210W
HC210
HC220
HC220
HC230
HC240
HC240
HardCopy II
Table 1–2. Stratix II FPGA to HardCopy II Migration Paths
Device
The HC210W device uses a wire bond package while the Stratix II FPGA prototype device uses a pin-compatible
flip-chip package.
Depending on design specific resource utilization, an opportunistic migration path may exist between this device
pair. Be sure to confirm your design is a potential candidate for such a path by fitting with the Quartus II software
and consulting an Altera applications engineer.
Table
484-pin FineLine BGA
484-pin FineLine BGA
672-pin FineLine BGA
780-pin FineLine BGA
1,020-pin FineLine BGA
1,020-pin FineLine BGA
1,508-pin FineLine BGA
1–2:
Package
HardCopy II devices offer pin-to-pin compatibility to the Stratix II
prototype, which makes them drop-in replacements for the FPGAs.
Therefore, the same system board and software developed for
prototyping and field trials can be retained, enabling the fastest
time-to-market for high-volume production. When migrating a specific
Stratix II FPGA to a HardCopy II device, there are a number of FPGA
prototype choices, as shown in
resource needs, designers can choose an appropriate HardCopy II device.
(1)
EP2S30
v
v
EP2S60
v
v
v
Table
Stratix II Device
1–2. Depending on the design
EP2S90
v
v
v
v
(2)
(2)
EP2S130
v
v
(2)
Altera Corporation
September 2008
EP2S180
v
v
v
(2)