ADSP-BF514KSWZ-4F4 Analog Devices Inc, ADSP-BF514KSWZ-4F4 Datasheet - Page 2

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ADSP-BF514KSWZ-4F4

Manufacturer Part Number
ADSP-BF514KSWZ-4F4
Description
Low-Pwr BF Proc W/flash & Cnsmr Conctvty
Manufacturer
Analog Devices Inc
Series
Blackfin®r
Type
Fixed Pointr

Specifications of ADSP-BF514KSWZ-4F4

Interface
I²C, PPI, RSI, SPI, SPORT, UART/USART
Clock Rate
400MHz
Non-volatile Memory
FLASH (4Mbit)
On-chip Ram
116kB
Voltage - I/o
1.8V, 2.5V, 3.3V
Voltage - Core
1.30V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
176-LQFP Exposed Pad, 176-eLQFP, 176-HLQFP
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
400MHz
Device Input Clock Speed
400MHz
Ram Size
48KB
Program Memory Size
1024KB
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
176
Package Type
LQFP EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADSP-BF514KSWZ-4F4
Manufacturer:
Analog Devices Inc
Quantity:
10 000
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
TABLE OF CONTENTS
Features ................................................................. 1
Memory ................................................................ 1
Peripherals ............................................................. 1
Table Of Contents .................................................... 2
Revision History ...................................................... 2
General Description ................................................. 3
REVISION HISTORY
8/10—Rev. 0 to Rev. A
Revised
Revised
Revised
Revised
Revised t
Mode) ................................................................. 41
Revised t
Clock .................................................................. 42
Revised t
Port—Master Timing .............................................. 46
Portable Low Power Architecture ............................. 3
System Integration ................................................ 3
Processor Peripherals ............................................. 3
Blackfin Processor Core .......................................... 3
Memory Architecture ............................................ 5
DMA Controllers ................................................ 10
Real-Time Clock ................................................. 11
Watchdog Timer ................................................ 11
Timers ............................................................. 11
3-phase PWM .................................................... 12
General-Purpose (GP) Counter .............................. 12
Serial Ports ........................................................ 12
Serial Peripheral Interface (SPI) Ports ...................... 13
UART Ports ...................................................... 13
2-Wire Interface (TWI) ........................................ 13
Removable Storage Interface (RSI) .......................... 13
10/100 Ethernet MAC .......................................... 14
IEEE 1588 Support .............................................. 14
Ports ................................................................ 14
Parallel Peripheral Interface (PPI) ........................... 15
Code Security with Lockbox Secure Technology ......... 15
Dynamic Power Management ................................ 15
Operating Conditions .................................. 25
Electrical Characteristics ............................... 27
Absolute Maximum Ratings ........................... 30
Maximum OTP Memory Programming Time .... 30
ODLY
SUDTE
SPITDM
parameter in
, t
parameter in
SUDRE
parameters in
RSI Controller Timing (High Speed
Serial Peripheral Interface (SPI)
Serial Ports—External
Rev. A | Page 2 of 72 | August 2010
Signal Descriptions ................................................. 22
Specifications ........................................................ 25
176-Lead LQFP Lead Assignment ............................... 62
168-Ball CSP_BGA Ball assignment ............................ 65
Outline Dimensions ................................................ 68
Automotive Products .............................................. 70
Ordering Guide ..................................................... 70
Revised t
face (SPI) Port—Slave Timing ................................... 47
Revised
Added several new ADSP-BF516 models.
Voltage Regulation Interface .................................. 17
Clock Signals ...................................................... 17
Booting Modes ................................................... 18
Instruction Set Description .................................... 20
Development Tools .............................................. 20
Designing an Emulator-Compatible
Related Documents .............................................. 20
Related Signal Chains ........................................... 20
Lockbox Secure Technology Disclaimer .................... 21
Operating Conditions ........................................... 25
Electrical Characteristics ....................................... 27
Flash Memory Characteristics ................................ 29
Absolute Maximum Ratings ................................... 30
Package Information ............................................ 31
ESD Sensitivity ................................................... 31
Timing Specifications ........................................... 32
Output Drive Currents ......................................... 55
Test Conditions .................................................. 57
Thermal Characteristics ........................................ 61
Surface-Mount Design .......................................... 69
Processor Board (Target) ................................... 20
BGA Data for Use with Surface-Mount Design ... 69
HDS
, t
SPITDS
, t
SDSCI
parameters in
Serial Peripheral Inter-
Ordering Guide 70

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