AFS250-FGG256 Actel, AFS250-FGG256 Datasheet - Page 257

FPGA - Field Programmable Gate Array 250K System Gates

AFS250-FGG256

Manufacturer Part Number
AFS250-FGG256
Description
FPGA - Field Programmable Gate Array 250K System Gates
Manufacturer
Actel
Datasheet

Specifications of AFS250-FGG256

Processor Series
AFS250
Core
IP Core
Maximum Operating Frequency
1098.9 MHz
Number Of Programmable I/os
114
Data Ram Size
36864
Supply Voltage (max)
1.575 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Development Tools By Supplier
AFS-Eval-Kit, AFS-BRD600, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.425 V
Number Of Gates
250 K
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AFS250-FGG256
Manufacturer:
Actel
Quantity:
135
Part Number:
AFS250-FGG256
Manufacturer:
ACTEL
Quantity:
6 800
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Manufacturer:
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Quantity:
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Part Number:
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Quantity:
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Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient, case, or board temperatures. This is an important distinction because dynamic and static power
consumption will cause the chip's junction temperature to be higher than the ambient, case, or board
temperatures.
gradient, and power.
where
Table 3-6 • Package Thermal Resistance
θ
θ
θ
T
T
T
T
P
Product
AFS090-QN108
AFS090-QN180
AFS250-QN180
AFS090-FG256
AFS250-FG256
AFS600-FG256
AFS1500-FG256
AFS600-FG484
AFS1500-FG484
JA
JB
JC
A
J
B
C
= Junction-to-air thermal resistance
= Junction-to-board thermal resistance
= Junction-to-case thermal resistance
= Junction temperature
= Ambient temperature
= Board temperature (measured 1.0 mm away from the
= Case temperature
= Total power dissipated by the device
package edge)
EQ 1
through
X = 7.62; Y = 9.98
X = 7.62; Y = 9.98
X = 5.10; Y = 7.3
X = 5.10; Y = 7.3
X = 3.4; Y = 4.8
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
X = 3.4; Y = 4.8
X = 4.0; Y = 5.6
Die Size
(mm)
EQ 3
give the relationship between thermal resistance, temperature
Still Air
R e v i s i o n 1
θ
θ
θ
JC
JA
JB
34.5
33.3
32.2
37.7
33.7
28.9
23.3
21.8
21.6
=
=
=
T
----------------- -
T
------------------ -
T
------------------ -
J
J
J
P
P
P
1.0 m/s
θ
T
T
30.0
27.6
26.5
33.9
30.0
25.2
19.6
18.2
16.8
θ
A
B
C
JA
Actel Fusion Family of Mixed Signal FPGAs
2.5 m/s
27.7
25.7
24.7
32.2
28.3
23.5
18.0
16.7
15.2
11.5
θ
8.1
9.2
5.7
9.3
6.8
4.3
7.7
5.6
JC
16.7
21.2
15.0
29.7
24.8
19.9
14.2
16.8
14.9
θ
JB
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
EQ 1
EQ 2
EQ 3
3 -7

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