AT91SAM7SE256B-AUR Atmel, AT91SAM7SE256B-AUR Datasheet - Page 209

IC ARM7 MCU FLASH 256K 128-LQFP

AT91SAM7SE256B-AUR

Manufacturer Part Number
AT91SAM7SE256B-AUR
Description
IC ARM7 MCU FLASH 256K 128-LQFP
Manufacturer
Atmel
Series
AT91SAMr
Datasheet

Specifications of AT91SAM7SE256B-AUR

Core Processor
ARM7
Core Size
16/32-Bit
Speed
55MHz
Connectivity
EBI/EMI, I²C, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
88
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Processor Series
SAM7SE256
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SPI, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
88
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Processor To Be Evaluated
AT91SAM7SE256B
Supply Current (max)
60 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91SAM7SE256B-AUR
Manufacturer:
Atmel
Quantity:
10 000
23.6.5.2
Figure 23-8. Low-power Mode Behavior
6222F–ATARM–14-Jan-11
SDCKE
D[31:0]
A[12:0]
(input)
SDCS
SDCK
RAS
CAS
Low-power Mode
Row n
Low-power mode is used in power-down mode, i.e., when no access to the SDRAM device is
possible. In this mode, power consumption is greater than in self-refresh mode. This state is sim-
ilar to normal mode (No low-power mode/No self-refresh mode), but the SDCKE pin is low and
the input and output buffers are deactivated as soon as the SDRAM device is no longer accessi-
ble. In contrast to self-refresh mode, the SDRAM device cannot remain in low-power mode
longer than the refresh period (64 ms for a whole device refresh operation). As no auto-refresh
operations are performed in this mode, the SDRAM Controller carries out the refresh operation.
In order to exit low-power mode, a NOP command is required. The exit procedure is faster than
in self-refresh mode.
When self-refresh mode is enabled, it is recommended to avoid enabling low-power mode.
When low-power mode is enabled, it is recommended to avoid enabling self-refresh mode.
This is described in
T
RCD
= 3
col a
CAS = 2
Figure 23-8
col b
Dna
col c
below.
Dnb
col d
SAM7SE512/256/32 Preliminary
Dnc
col e
Dnd
col f
Dne
Dnf
Low Power Mode
209

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