MC908AZ60ACFU Freescale Semiconductor, MC908AZ60ACFU Datasheet - Page 403
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MC908AZ60ACFU
Manufacturer Part Number
MC908AZ60ACFU
Description
IC MCU FLASH 8.4MHZ 60K 64QFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet
1.MC908AZ60ACFUER.pdf
(414 pages)
Specifications of MC908AZ60ACFU
Core Processor
HC08
Core Size
8-Bit
Speed
8.4MHz
Connectivity
CAN, SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
52
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 15x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Freescale Semiconductor
Programmable Interrupt Timer
Computer Operating Properly
Timer Interface Module B
Timer Interface Module A
Electrical Specifications
Keyboard Module
Section affected
Monitor ROM
Appendix A
(TIMA-6)
(TIMB)
(MON)
(COP)
(KBD)
(PIT)
MC68HC908AZ60A • MC68HC908AS60A • MC68HC908AS60E Data Sheet, Rev. 6
Modified Figure 1-Monitor Mode Circuit based upon recommendations from
applications engineering.
Correct text of Note 1 to Table 2-Mode Differences.
Corrected type errors.
Corrected text describing state of unprogrammed FLASH in Security
subsection.
Corrected Figure 6-Monitor Mode Entry Timing.
Corrected state of COPL bit in Functional Description subsection.
Corrected numerous type and grammatical errors.
Corrected numerous pin and register name errors within text.
Corrected references to TIMB overflow interrupts (removed "channel x"
references as they are incorrect).
Corrected type and grammatical errors.
Corrected PIT Overflow Interrupt Enable Bit acronym from PIE to POIE.
Corrected addresses of KBSCR and KBIER within text.
Corrected numerous type and grammatical errors.
Corrected numerous pin and register name errors within text.
Corrected references to TIMA overflow interrupts (removed "channel x"
references as they are incorrect).
Corrected functional description of TOF flag.
Corrected type errors.
Increased VHI specification in Maximum Ratings to VDD + 4.5V.
Corrected formula for Average Junction Temperature in Thermal
Characteristics.
Added column for typical VDD Supply Current values in 5.0 Volt DC Electrical
Characteristics.
Decreased LVI trip voltage specification to 3.80V and increased LVI recovery
voltage to 4.49V in 5.0 Volt DC Electrical Characteristics.
Increased VHI specification to minimum of VDD + 3.0V and maximum of VDD
+ 4.5V in 5.0 Volt DC Electrical Characteristics.
Added Unit columns to all CGM specification tables and adjusted text
accordingly.
Corrected Operating Voltage specification in CGM Operating Conditions.
Added typical specifications for Kacq and Ktrk parameters in CGM
Acquisition/Lock Time Information.
Split Memory Characteristics table into separate RAM Memory Characteristics,
EEPROM Memory Characteristics and FLASH Memory Characteristics tables.
Added maximum specification for EEPROM AUTO bit set for each of program
and erase operation in EEPROM Memory Characteristics.
Corrected NOTES section of FLASH Memory Characteristics.
Added Note 3 to BDLC Transmitter VPW Symbol Timings table.
Added text describing elimination of need for VHI on IRQ pin to program/erase
FLASH block protect registers.
Added subsection highlighting change of Monitor Mode entry and COP disable
voltage change.
Added subsection highlighting change in LVI trip and recovery voltage
specifications.
Description of change
Revision History
403
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