DF3048X16V Renesas Electronics America, DF3048X16V Datasheet - Page 605
![MCU 5V 128K,PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3048X16V
Manufacturer Part Number
DF3048X16V
Description
MCU 5V 128K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3048X16V
Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3048X16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 605 of 907
- Download datasheet (6Mb)
Section 18 ROM
18.3.3
Reliability of Programmed Data
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 18.6 shows the recommended screening procedure.
Program chip and verify programmed data
Bake chip for 24 to 48 hours at
125 C to 150 C with power off
Read and check program
Install
Figure 18.6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects. Please inform
Renesas Technology of any abnormal conditions noted during or after programming or in
screening of program data after high-temperature baking.
Rev. 7.00 Sep 21, 2005 page 579 of 878
REJ09B0259-0700
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