AT91SAM9XE256-CU Atmel, AT91SAM9XE256-CU Datasheet - Page 248

• Manufacturer Part Number: AT91SAM9XE256-CU
• Description: MCU ARM9 256K FLASH 217-BGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9XE256-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 96
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 217-LFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: 2-Wire, EBI, I2S, SPI, USART
• Maximum Clock Frequency: 180 MHz
• Number Of Programmable I/os: 96
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, KSK-AT91SAM9XE-PL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9XE-EK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Package: 217LFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 180 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• For Use With: AT91SAM9XE-EK - KIT EVAL FOR AT91SAM9XEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

24.5.5.1
Figure 24-6. Self-refresh Mode Behavior
6254C–ATARM–22-Jan-10
SDRAMC_A[12:0]
SDRAMC_SRR
SDCKE
SDWE
SDCK
SDCS
Write
RAS
CAS
Self-refresh Mode
SRCB = 1
This mode is selected by programming the LPCB field to 1 in the SDRAMC Low Power Register.
In self-refresh mode, the SDRAM device retains data without external clocking and provides its
own internal clocking, thus performing its own auto-refresh cycles. All the inputs to the SDRAM
device become “don’t care” except SDCKE, which remains low. As soon as the SDRAM device
is selected, the SDRAM Controller provides a sequence of commands and exits self-refresh
mode.
Some low-power SDRAMs (e.g., mobile SDRAM) can refresh only one quarter or a half quarter
or all banks of the SDRAM array. This feature reduces the self-refresh current. To configure this
feature, Temperature Compensated Self Refresh (TCSR), Partial Array Self Refresh (PASR)
and Drive Strength (DS) parameters must be set in the Low Power Register and transmitted to
the low-power SDRAM during initialization.
The SDRAM device must remain in self-refresh mode for a minimum period of t
remain in self-refresh mode for an indefinite period. This is described in
AT91SAM9XE128/256/512 Preliminary
Self Refresh Mode
to the SDRAM Controller
Access Request
T
Figure
XSR
= 3
24-6.
RAS
Row
and may
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