ATSAM3S4AA-MU Atmel, ATSAM3S4AA-MU Datasheet - Page 1046

IC MCU 32BIT 256KB FLASH 48QFN

ATSAM3S4AA-MU

Manufacturer Part Number
ATSAM3S4AA-MU
Description
IC MCU 32BIT 256KB FLASH 48QFN
Manufacturer
Atmel
Series
SAM3Sr
Datasheets

Specifications of ATSAM3S4AA-MU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
34
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 8x10/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-VQFN Exposed Pad, 48-HVQFN, 48-SQFN, 48-DHVQFN
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S4AA-MU
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
1046
SAM3S Preliminary
Figure 41-6. Current Consumption in Sleep Mode (AMP1) versus Master Clock ranges (Condi-
Table 41-10.
Table 41-9.
Core Clock/MCK (MHz)
64
48
32
24
There is no activity on the I/Os of the
Figure 41-6 on page 1046
18.000
16.000
14.000
12.000
10.000
8.000
6.000
4.000
2.000
0.000
MCK = 48 MHz
Conditions
tion from
Sleep mode Current consumption versus Master Clock (MCK) variation with PLLA
Typical Current Consumption for Sleep Mode
0
device.
4
Table
8
12
@25°C
15.5
12.2
8
6.5
41-9)
VDDCORE Consumption
Processor and Peripheral Clocks in MHz
16 20
(AMP1)
Consumption
24
VDDCORE
(AMP1)
12.2
28
32 36
18.71
14.18
9.57
8.58
Consumption
40
Total Consumption
(AMP2)
14.18
Total
44 48
(AMP2)
52
6500C–ATARM–8-Feb-11
56 60
Unit
mA
mA
mA
mA
mA
64
Unit

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