HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 764

• Manufacturer Part Number: HD64F38024DV
• Description: IC H8/SLP MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300L SLPr

Specifications of HD64F38024DV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

.INCLUDE
Description Format: .INCLUDE "<file name>"
Description:
Example:
750
The label field is not used.
.INCLUDE is the file inclusion assembler directive. If no file extension is
specified, only the file name is used as specified (the assembler does not
assume any default file extension).
The file name can include the directory path name. The directory can be
specified either by the absolute path (path from the root directory) or by the
relative path (path from the current directory).
Included files can include other files. The nesting depth for file inclusion is
limited to 30 levels.
The directory name of the filenames specified by .INCLUDE can be changed
by the include option.
This example assumes the following directory configuration and operations:
The start command is as follows:
>asm38 c:\dir1\file1.src (RET)
file1.src must have the following include directive:
Starts the assembler from the root directory (c:\)
Inputs source file c:\dir1\file1.src
Makes file2.h included in file1.src
Makes file3.h included in file2.h
file1.src
dir1
C: C: C: C:
\
file2.h
dir2
file3.h