IDT82P2816BB IDT, Integrated Device Technology Inc, IDT82P2816BB Datasheet - Page 5

• Manufacturer Part Number: IDT82P2816BB
• Description: IC LIU T1/J1/E1 16+1CH 416-PBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT82P2816BB

• Function: Line Interface Unit (LIU)
• Interface: E1, J1, T1
• Number Of Circuits: 1
• Voltage - Supply: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: *
• Includes: Defect and Alarm Detection, Driver Over-Current Detection and Protection, LLOS Detection, PRBSARB / IB Detection and Generation
• Number Of Transceivers: 1
• Screening Level: Industrial
• Mounting: Surface Mount
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -
• Power (watts): -
• Lead Free Status / RoHS Status: Not Compliant, Contains lead / RoHS non-compliant
• Other names: 82P2816BB

5 PROGRAMMING INFORMATION ................................................................................................................................... 69
6 JTAG ............................................................................................................................................................................. 113
7 THERMAL MANAGEMENT .......................................................................................................................................... 115
8 PHYSICAL AND ELECTRICAL SPECIFICATIONS ..................................................................................................... 116
Table of Contents
IDT82P2816
4.2 MICROPROCESSOR INTERFACE ......................................................................................................................... 65
4.3 POWER UP .............................................................................................................................................................. 66
4.4 HITLESS PROTECTION SWITCHING (HPS) SUMMARY ...................................................................................... 66
5.1 REGISTER MAP ...................................................................................................................................................... 69
5.2 REGISTER DESCRIPTION ..................................................................................................................................... 73
6.1 JTAG INSTRUCTION REGISTER (IR) .................................................................................................................. 113
6.2 JTAG DATA REGISTER ........................................................................................................................................ 113
6.3 TEST ACCESS PORT (TAP) CONTROLLER ....................................................................................................... 113
7.1 JUNCTION TEMPERATURE ................................................................................................................................. 115
7.2 EXAMPLE OF JUNCTION TEMPERATURE CALCULATION ............................................................................... 115
7.3 HEATSINK EVALUATION ..................................................................................................................................... 115
8.1 ABSOLUTE MAXIMUM RATINGS ......................................................................................................................... 116
8.2 RECOMMENDED OPERATING CONDITIONS .................................................................................................... 117
8.3 DEVICE POWER CONSUMPTION AND DISSIPATION (TYPICAL) 1 ................................................................. 118
8.4 DEVICE POWER CONSUMPTION AND DISSIPATION (MAXIMUM) 1 ............................................................... 119
8.5 D.C. CHARACTERISTICS ..................................................................................................................................... 120
8.6 E1 RECEIVER ELECTRICAL CHARACTERISTICS ............................................................................................. 121
8.7 T1/J1 RECEIVER ELECTRICAL CHARACTERISTICS ......................................................................................... 122
8.8 E1 TRANSMITTER ELECTRICAL CHARACTERISTICS ...................................................................................... 123
8.9 T1/J1 TRANSMITTER ELECTRICAL CHARACTERISTICS ................................................................................. 124
8.10 TRANSMITTER AND RECEIVER TIMING CHARACTERISTICS ......................................................................... 125
8.11 CLKE1 TIMING CHARACTERISTICS ................................................................................................................... 127
8.12 JITTER ATTENUATION CHARACTERISTICS ...................................................................................................... 128
8.13 MICROPROCESSOR INTERFACE TIMING ......................................................................................................... 131
4.1.4
5.1.1
5.1.2
5.2.1
5.2.2
6.2.1
6.2.2
6.2.3
8.13.1 Serial Microprocessor Interface ................................................................................................................ 131
8.13.2 Parallel Motorola Non-Multiplexed Microprocessor Interface ................................................................... 133
8.13.3 Parallel Intel Non-Multiplexed Microprocessor Interface ........................................................................... 135
Per-Channel Software Reset ...................................................................................................................... 65
Global Register ........................................................................................................................................... 69
Per-Channel Register ................................................................................................................................. 70
Global Register ........................................................................................................................................... 73
Per-Channel Register ................................................................................................................................. 81
Device Identification Register (IDR) .......................................................................................................... 113
Bypass Register (BYP) ............................................................................................................................. 113
Boundary Scan Register (BSR) ................................................................................................................ 113
8.13.2.1 Read Cycle Specification .......................................................................................................... 133
8.13.2.2 Write Cycle Specification .......................................................................................................... 134
8.13.3.1 Read Cycle Specification .......................................................................................................... 135
8.13.3.2 Write Cycle Specification .......................................................................................................... 136
16(+1) CHANNEL HIGH-DENSITY T1/E1/J1 LINE INTERFACE UNIT
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February 6, 2009