MC56F8006DEMO Freescale Semiconductor, MC56F8006DEMO Datasheet - Page 44

• Manufacturer Part Number: MC56F8006DEMO
• Description: DEMO BOARD FOR MC56F8006
• Manufacturer: Freescale Semiconductor
• Type: DSPr

Specifications of MC56F8006DEMO

• Contents: Board
• Processor To Be Evaluated: MC56F8006
• Interface Type: RS-232, USB
• Operating Supply Voltage: 3.3 V
• Silicon Manufacturer: Freescale
• Core Architecture: 56800/E
• Core Sub-architecture: 56800/E
• Silicon Core Number: MC56F
• Silicon Family Name: MC56F80xx
• Rohs Compliant: Yes
• For Use With/related Products: MC56F8006
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Specifications
8.4
This section includes information about recommended operating conditions.
44
Ambient Operating Temperature (Extended
Output Source Current Low (at V
Output Source Current High at V
When programmed for high drive strength
When programmed for high drive strength
When programmed for low drive strength
When programmed for low drive strength
XTAL driven by an external clock source
Input Voltage High (digital inputs)
Input Voltage Low (digital inputs)
Flash Data Retention with <100
Voltage difference V
Voltage difference V
Oscillator Input Voltage High
Oscillator Input Voltage Low
Using external clock source
Using relaxation oscillator
Device Clock Frequency
(Program Erase Cycles)
Program/Erase Cycles
Recommended Operating Conditions
Flash Data Retention
Flash Endurance
Characteristic
Supply voltage
Industrial)
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
See
considerations.
Section 9.1, “Thermal Design
DD
SS
to V
to V
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 3
OL
SSA
OH
DDA
Table 18. Recommended Operating Conditions
max.)
min.)
(V
1
1
REFL x
V
FSYSCLK
Symbol
DD,
V
V
t
FLRET
IHOSC
ILOSC
V
I
V
V
I
V
N
T
OH
t
OL
= 0 V, V
R
V
IH
DD
IL
A
SS
F
Considerations,” for more detail on thermal design
DDA
T
SSA
A
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
Pin Groups 1, 2
= –40°C to 125°C
T
T
Pin Group 4
Pin Group 4
Pin Group 1
Pin Group 1
J
J
= 0 V, V
Notes
85°C avg
85°C avg
SS
= 0 V)
10,000
–0.1
–0.1
–0.3
–0.3
Min
–40
2.0
2.0
15
20
—
—
—
—
3
1
0
Typ
3.3
—
0
0
Freescale Semiconductor
V
DDA
Max
V
105
3.6
0.1
0.1
0.8
0.8
32
32
–4
–8
—
—
—
4
8
DD
+ 0.3
cycles
years
years
Unit
MHz
mA
mA
°C
V
V
V
V
V
V
V