C8051F800DK Silicon Laboratories Inc, C8051F800DK Datasheet - Page 4

• Manufacturer Part Number: C8051F800DK
• Description: KIT DEV C8051F800
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F800DK

• Contents: Board, Cables, CD, Debugger, Power Supply
• Processor To Be Evaluated: C8051F800
• Data Bus Width: 16 bit
• Interface Type: USB
• Operating Supply Voltage: 7 V to 15 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: C8051F8xx
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: 336-1797

C8051F80x-83x
16. In-System Device Identification............................................................................ 95
17. Special Function Registers................................................................................... 97
18. Interrupts .............................................................................................................. 102
19. Flash Memory....................................................................................................... 113
20. Power Management Modes................................................................................. 120
21. Reset Sources ...................................................................................................... 123
22. Oscillators and Clock Selection ......................................................................... 129
23. Port Input/Output ................................................................................................. 138
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15.2. Data Memory ................................................................................................... 93
18.1. MCU Interrupt Sources and Vectors.............................................................. 103
18.2. Interrupt Register Descriptions ...................................................................... 104
18.3. INT0 and INT1 External Interrupts................................................................. 111
19.1. Programming The Flash Memory .................................................................. 113
19.2. Non-volatile Data Storage ............................................................................. 114
19.3. Security Options ............................................................................................ 114
19.4. Flash Write and Erase Guidelines ................................................................. 115
20.1. Idle Mode....................................................................................................... 120
20.2. Stop Mode ..................................................................................................... 121
20.3. Suspend Mode .............................................................................................. 121
21.1. Power-On Reset ............................................................................................ 124
21.2. Power-Fail Reset / VDD Monitor ................................................................... 125
21.3. External Reset ............................................................................................... 126
21.4. Missing Clock Detector Reset ....................................................................... 126
21.5. Comparator0 Reset ....................................................................................... 127
21.6. PCA Watchdog Timer Reset ......................................................................... 127
21.7. Flash Error Reset .......................................................................................... 127
21.8. Software Reset .............................................................................................. 127
22.1. System Clock Selection................................................................................. 129
22.2. Programmable Internal High-Frequency (H-F) Oscillator .............................. 131
22.3. External Oscillator Drive Circuit..................................................................... 133
15.2.1. Internal RAM ........................................................................................... 93
18.1.1. Interrupt Priorities.................................................................................. 103
18.1.2. Interrupt Latency ................................................................................... 103
19.1.1. Flash Lock and Key Functions .............................................................. 113
19.1.2. Flash Erase Procedure ......................................................................... 113
19.1.3. Flash Write Procedure .......................................................................... 114
19.4.1. VDD Maintenance and the VDD Monitor .............................................. 116
19.4.2. PSWE Maintenance .............................................................................. 116
19.4.3. System Clock ........................................................................................ 117
22.3.1. External Crystal Example...................................................................... 135
22.3.2. External RC Example............................................................................ 136
22.3.3. External Capacitor Example.................................................................. 137
15.2.1.1. General Purpose Registers ............................................................ 94
15.2.1.2. Bit Addressable Locations .............................................................. 94
15.2.1.3. Stack ............................................................................................ 94
Rev. 1.0