C8051F800DK Silicon Laboratories Inc, C8051F800DK Datasheet - Page 36

• Manufacturer Part Number: C8051F800DK
• Description: KIT DEV C8051F800
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F800DK

• Contents: Board, Cables, CD, Debugger, Power Supply
• Processor To Be Evaluated: C8051F800
• Data Bus Width: 16 bit
• Interface Type: USB
• Operating Supply Voltage: 7 V to 15 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With/related Products: C8051F8xx
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: 336-1797

C8051F80x-83x
36
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 µm minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C
E
X
Y
Table 5.2. QSOP-24 PCB Land Pattern Dimensions
Figure 5.2. QSOP-24 PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
Min
0.635 BSC
Max
5.30
0.40
1.60