CY7C1471BV25_11 CYPRESS [Cypress Semiconductor], CY7C1471BV25_11 Datasheet - Page 22

• Manufacturer Part Number: CY7C1471BV25_11
• Description: 72-Mbit (2 M x 36/4 M x 18/1 M x 72) Flow-Through SRAM with NoBL Architecture
• Manufacturer: CYPRESS [Cypress Semiconductor]

Capacitance
Tested initially and after any design or process change that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Document Number: 001-15013 Rev. *H
C
C
C
C
C
Parameter
ADDRESS
DATA
CTRL
CLK
IO
Parameter
OUTPUT


2.5 V IO Test Load
JA
JC
Address Input Capacitance
Data Input Capacitance
Control Input Capacitance
Clock Input Capacitance
Input-Output Capacitance
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Z
0
= 50 
Description
Description
(a)
V
L
= 1.25 V
R
L
= 50 
OUTPUT
2.5 V
Figure 4. AC Test Loads and Waveforms
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance,
according to EIA/JESD51.
T
V
A
DD
INCLUDING
= 25°C, f = 1 MHz,
JIG AND
Test Conditions
Test Conditions
= 2.5 V, V
SCOPE
5 pF
DDQ
(b)
R = 1667 
= 2.5 V
R = 1538 
100-pin TQFP
100-pin TQFP
Package
CY7C1473BV25, CY7C1475BV25
24.63
2.28
Max
V
GND
6
5
8
6
5
DDQ
 1 ns
10%
165-ball FBGA
165-ball FBGA
Package
ALL INPUT PULSES
16.3
Max
2.1
6
5
8
6
5
90%
CY7C1471BV25
(c)
209-ball FBGA
209-ball FBGA
Package
15.2
Max
1.7
6
5
8
6
5
90%
Page 22 of 33
10%
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
pF
pF
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