hm5216165 Elpida Memory, Inc., hm5216165 Datasheet - Page 34

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hm5216165

Manufacturer Part Number
hm5216165
Description
16 M Lvttl Interface Sdram 512-kword ? 16-bit ? 2-bank
Manufacturer
Elpida Memory, Inc.
Datasheet

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HM5216165 Series
Refresh
Auto-refresh: All the banks must be precharged before executing an auto-refresh command. Since the auto-
refresh command updates the internal counter every time it is executed and determines the banks and the
ROW addresses to be refreshed, external address specification is not required. The refresh cycle is 4096
cycles/64 ms. (4096 cycles are required to refresh all the ROW addresses.) The output buffer becomes High-
Z after auto-refresh start. In addition, since a precharge has been completed by an internal operation after the
auto-refresh, an additional precharge operation by the precharge command is not required.
Self-refresh: After executing a self-refresh command, the self-refresh operation continues while CKE is held
Low. During self-refresh operation, all ROW addresses are refreshed by the internal refresh timer. A self-
refresh is terminated by a self-refresh exit command. If you use distributed auto-refresh mode with 15.6 µs
interval in normal read/write cycle, auto-refresh should be executed within 15.6 µs immediately after exiting
from and before entering into self refresh mode. If you use address refresh or burst auto-refresh mode in
normal read/write cycle, 4096 cycles of distributed auto-refresh with 15.6 µs interval should be executed
within 64 ms immediately after exiting from and before entering into self refresh mode.
Others
Power-down mode: The synchronous DRAM enters power-down mode when CKE goes Low in the IDLE
state. In power down mode, power consumption is suppressed by deactivating the input initial circuit. Power
down mode continues while CKE is held Low. In addition, by setting CKE to High, the synchronous DRAM
exits from the power down mode, and command input is enabled from the next cycle. In this mode, internal
refresh is not performed.
Clock suspend mode: By driving CKE to Low during a bank-active or read/write operation, the synchronous
DRAM enters clock suspend mode. During clock suspend mode, external input signals are ignored and the
internal state is maintained. When CKE is driven High, the synchronous DRAM terminates clock suspend
mode, and command input is enabled from the next cycle. For details, refer to the “CKE Truth Table”.
Power-up sequence: During power-up sequence, the DQMU/DQML and the CKE must be set to High.
When 200 µs has past after power on, all banks must be precharged using the precharge command. After t
RP
delay, set 8 or more auto refresh commands. And set the mode register set command to initialize the mode
register.
Data Sheet E0167H10
34

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