mpc8313e Freescale Semiconductor, Inc, mpc8313e Datasheet - Page 80

• Manufacturer Part Number: mpc8313e
• Description: Mpc8313e Powerquicc Ii Pro Processor
• Manufacturer: Freescale Semiconductor, Inc

Thermal
Interface material vendors include the following:
20.3
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
80
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
Corporate Center
PO BOX 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Heat Sink Attachment
MPC8313E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 0
408-436-8770
800-522-6752
603-635-2800
781-935-4850
800-248-2481
888-642-7674
800-347-4572
Freescale Semiconductor