mpc8313e Freescale Semiconductor, Inc, mpc8313e Datasheet - Page 79

• Manufacturer Part Number: mpc8313e
• Description: Mpc8313e Powerquicc Ii Pro Processor
• Manufacturer: Freescale Semiconductor, Inc

Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink Vendors include the following list:
Freescale Semiconductor
MEI, 75x85x12 mm, adjacent board, 40 mm Side bypass
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Table 63. Heat Sinks and Junction-to-Case Thermal Resistance of MPC8313E (TEPBGAII)
MEI, 75x85x12 no adjacent board, extrusion
MEI, 75x85x12 no adjacent board, extrusion
MEI, 75x85x12 no adjacent board, extrusion
Heat Sink Assuming Thermal Grease
Wakefield, 53x53x25 mm Pin Fin
Wakefield, 53x53x25 mm Pin Fin
Wakefield, 53x53x25 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 30x30x9.4 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
AAVID 31x35x23 mm Pin Fin
MPC8313E PowerQUICC
™
II Pro Processor Hardware Specifications, Rev. 0
Natural Convection
Natural Convection
Natural Convection
Natural Convection
603-224-9988
408-749-7601
818-842-7277
Air Flow
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
2 m/s
1 m/s
Junction-to-Ambient
Thermal Resistance
35x35 mm TBGA
10.7
6.2
5.3
8.1
4.4
3.7
5.4
3.2
2.4
6.4
3.8
2.5
2.8
Thermal
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