mpc8313e Freescale Semiconductor, Inc, mpc8313e Datasheet - Page 56

• Manufacturer Part Number: mpc8313e
• Description: Mpc8313e Powerquicc Ii Pro Processor
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
18 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8313E is available in
a thermally enhanced plastic ball grid array (TEPBGAII), see
MPC8313E TEPBGAII,”
information on the TEPBGAII.
18.1
The package parameters are as provided in the following list. The package type is 27 mm × 27 mm, 516
TEPBGAII.
18.2
Figure 38
package.
56
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8313E TEPBGAII
Mechanical Dimensions of the MPC8313E TEPBGAII
shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII
MPC8313E PowerQUICC
and
Section 18.2, “Mechanical Dimensions of the MPC8313E TEPBGAII,”
™
II Pro Processor Hardware Specifications, Rev. 0
27 mm × 27 mm
1.00 mm
2.25 mm
95.5 Sn/0.5 Cu/4Ag (VR package)
516
0.6 mm
Section 18.1, “Package Parameters for the
Freescale Semiconductor
for