DSP56F807 Motorola Inc, DSP56F807 Datasheet - Page 41

• Manufacturer Part Number: DSP56F807
• Description: 56F807 16-bit Hybrid Processor
• Manufacturer: Motorola Inc

Part 4 Packaging
4.1 Package and Pin-Out Information 56F807
This section contains package and pin-out information for the 56F807. This device comes in two case types:
low-profile quad flat pack (LQFP) or mold array process ball grid assembly (MAPBGA).
the package outline for the LQFP case,
Table 38
case, and
56F807 Technical Data
GPIOB0
V
A10
A11
A12
A13
A14
A15
D10
V
D11
D12
D13
D14
D15
V
WR
RD
DS
PS
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
A0
A1
A2
A3
A4
A5
A6
A7
DD
A8
A9
DD
SS
lists the pinout for the LQFP case.
Table 39
PIN 1
lists the pinout for the MAPBGA package.
Figure 35. Top View, 56F807 160-pin LQFP Package
PIN 41
Freescale Semiconductor, Inc.
ORIENTATION
For More Information On This Product,
MARK
Figure 36
Go to: www.freescale.com
Motorola
Figure 37
56F807
shows the mechanical parameters for the LQFP case, and
shows the mechanical parameters for the MAPBGA
Package and Pin-Out Information 56F807
PIN 121
PIN 81
Figure 35
ANB7
ANB6
ANB5
ANB4
ANB3
ANB2
ANB1
ANB0
V
V
VREF2
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
V
V
VREF
RESET
RSTO
V
V
V
EXTAL
XTAL
V
V
V
V
V
EXTBOOT
FAULTA3
FAULTA2
FAULTA1
FAULTA0
PWMA5
SSA
DDA
SSA
DDA
DD
SS
DD
SS
SS
DD
DDA
SSA
shows
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