DSPIC33FJ64GP306 Microchip Technology Inc., DSPIC33FJ64GP306 Datasheet - Page 313

• Manufacturer Part Number: DSPIC33FJ64GP306
• Description: High-performance, 16-bit Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

APPENDIX A: DIFFERENCES
The dsPIC33FJXXXGPX06/X08/X10 devices marked
“PS” have some key differences from the final produc-
tion devices (devices not marked “PS”). The major dif-
ferences are listed in this appendix. In addition, there
are minor differences in several SFR names, bits and
Reset states, which are described in Section 3.0
“Memory Organization” and the corresponding
peripheral sections.
A.1
The Prototype Sample devices have a suffix “PS” in
their names, as marked on the device package. This
distinguishes them from Engineering Sample devices
(which are suffixed “ES”) and final production devices
(that have neither a “PS” nor an “ES” suffix on the
device package marking).
Prototype samples are available only for a subset of the
final production devices. Please refer to the device
tables in this data sheet for a listing of all devices.
A.2
The total RAM size, including the size of the dual ported
DMA RAM, is different between each “PS” device and
the corresponding final production device. For exam-
ple, the final production devices have 2 Kbytes DMA
RAM, whereas the “PS” devices have 1 Kbyte DMA
RAM. Please refer to the device tables in this data
sheet
dsPIC33FJXXXGPX06/X08/X10 device.
A.3
The final production devices have four more interrupt
sources (vectors) than the “PS” devices do. Also, two
of the interrupt vectors are associated with slightly dif-
ferent events from the corresponding interrupts in the
“PS” devices. Please refer to Section 6.0 “Interrupt
Controller” for more details.
A.4
Both “PS” and final production devices can perform
Direct Memory Access (DMA) data transfers.
In addition to all of the features supported by the DMA
controller in the “PS” devices, the DMA controller in the
final production devices also supports the Peripheral
Indirect Addressing mode. Please refer to Section 7.0
“Direct Memory Access (DMA)” for a description of
this feature.
© 2007 Microchip Technology Inc.
Device Names
RAM Sizes
Interrupts
DMA Enhancements
for
the
BETWEEN “PS”
(PROTOTYPE SAMPLE)
DEVICES AND FINAL
PRODUCTION DEVICES
memory
sizes
dsPIC33FJXXXGPX06/X08/X10
of
each
A.5
The default values of the PLL postscaler and feedback
divisor bits are different between the “PS” devices and
final production devices. Please refer to Section 8.0
“Oscillator Configuration” for the register definitions
and Reset states.
A.6
The dsPIC33FJXXXGPX06/X08/X10 devices marked
“PS” have up to two CAN modules. The functionality
and register layout of these modules are identical to
those of dsPIC30F devices, and are described in
Section 18.0 “Enhanced CAN (ECAN™) Module” of
this data sheet. These modules do not provide DMA
support.
The final production devices have up to two Enhanced
CAN (ECAN™ technology) modules. These modules
have significantly more features than the CAN mod-
ules, mainly in the form of an increased number of
available buffers, filters and masks, as well as DMA
support.
A.7
Both “PS” and final production devices contain up to
two ADC modules.
The “PS” devices have a 16-word deep ADC result
buffer.
The final production devices have enhanced DMA sup-
port in the form of additional DMA RAM and Peripheral
Indirect Addressing. This renders the 16-word ADC
buffer redundant. Hence, the buffer has been replaced
by a single ADC Result register.
A.8
The final production devices are offered in the following
TQFP packages:
• 64-pin TQFP 10x10x1 mm
• 80-pin TQFP 12x12x1 mm
• 100-pin TQFP 12x12x1 mm
• 100-pin TQFP 14x14x1 mm
The “PS” devices are offered in the following TQFP
packages:
• 64-pin TQFP 10x10x1 mm
• 80-pin TQFP 12x12x1 mm
• 100-pin TQFP 14x14x1 mm
Oscillator Operation
CAN and Enhanced CAN
Device Packages
ADC Differences
DS70286A-page 309