AT32UC3A464 Atmel Corporation, AT32UC3A464 Datasheet - Page 981
AT32UC3A464
Manufacturer Part Number
AT32UC3A464
Description
Manufacturer
Atmel Corporation
Datasheets
1.AT32UC3A0128.pdf
(377 pages)
2.AT32UC3A0128.pdf
(33 pages)
3.AT32UC3A0128.pdf
(159 pages)
4.AT32UC3A3128.pdf
(91 pages)
5.AT32UC3A3128.pdf
(1012 pages)
Specifications of AT32UC3A464
Flash (kbytes)
64 Kbytes
Pin Count
100
Max. Operating Frequency
66 MHz
Cpu
32-bit AVR
Hardware Qtouch Acquisition
No
Usb Transceiver
1
Usb Speed
Hi-Speed
Usb Interface
Device + OTG
Spi
6
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
2
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
10
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
128
Self Program Memory
YES
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
3.0 to 3.6
Operating Voltage (vcc)
3.0 to 3.6
Fpu
No
Timers
6
Output Compare Channels
6
Input Capture Channels
6
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
Available stocks
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- AT32UC3A0128 PDF datasheet
- AT32UC3A0128 PDF datasheet #2
- AT32UC3A0128 PDF datasheet #3
- AT32UC3A3128 PDF datasheet #4
- AT32UC3A3128 PDF datasheet #5
- Current page: 981 of 1012
- Download datasheet (16Mb)
36. Mechanical Characteristics
36.1
36.1.1
36.1.2
32072G–11/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 36-1
Table 36-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
page
Table 36-1 on page
characteristics” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
981.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
981.
JA
)
956.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
VFBGA100
TFBGA144
TFBGA144
VFBGA100
TQFP144
TQFP144
Package
Table 36-1 on
40.3
28.5
31.1
Typ
9.5
6.9
6.9
”Regulator
J
° C/W
° C/W
° C/W
in °C.
Unit
981
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